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Book Review: Analysis and Design of Analogue Integrated Circuits
Ludolf Herbst
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Statistical and behavioural modelling of analogue integrated circuits
IEE Proceedings G Circuits, Devices and Systems, 1993A full statistical model for the behavioural parameters of an analogue cell is presented. The parameter variations with respect to manufacturing tolerances are approximated by response surfaces which allow the mean, standard deviation, correlation of parameter pairs and the actual distribution to be estimated.
T. Koskinen, P.Y.K. Cheung
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Robust design of low power CMOS analogue integrated circuits
IEE Proceedings - Circuits, Devices and Systems, 2001As feature sizes move into the deep submicron ranges and power supply voltages are reduced, the effect of both device mismatch and inter-die process variations on the performance and reliability of analogue integrated circuits is magnified. The statistical MOS (SMOS) model accounts for both inter-die and intra-die variations.
T.B. Tarim, M. Ismail
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Simulation of the test process for analogue integrated circuits
1996 IEEE International Symposium on Circuits and Systems. Circuits and Systems Connecting the World. ISCAS 96, 2002The paper describes a new implementation of testing-algorithm model for analogue and mixed-signal circuits with neural network evaluation. The simulation system is programmable (different fault models, input stimuli, and different analyses), it covers a wide spectrum of test methods and desired post-process techniques.
J. Povazanec, V. Musil, J. Kaderka
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Analogue integrated circuit synthesis from VHDL-AMS behavioural specifications
2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595), 2003While digital circuit designs are now fully automated and can be delivered extremely quickly, the analogue part of a typical ASIC still needs to be designed manually. This paper discusses a way forward to overcome one of the obvious difficulties in analogue synthesis namely the lag in the development of appropriate synthesis methodologies to support ...
T.J. Kazmierski, F.A. Hamid
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A New Electrothermal Simulator in Analogue Integrated Circuit Design
2006 International Conference - Modern Problems of Radio Engineering, Telecommunications, and Computer Science, 2006In this paper the usage of electrothermal simulator for analogue circuit design is presented. In the first part the operating and usage rules are presented. In the second part the operational amplifier is presented with application of this software. In the third part the current mirror as an example is shown.
Marek Kaminski +2 more
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Gallium Arsenide Analogue Integrated Circuit Design Techniques
1993Modern communication systems, both microwave and optical, are beginning to rely heavily on the high frequency circuit performance capabilities provided by III-V semiconductor materials, of which the most mature is Gallium Arsenide (GaAs). The applications of GaAs can be divided into digital and analogue.The analogue applications can be further ...
Chris Toumazou, David Haigh
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Thermal Testing of Analogue Integrated Circuits: A Case Study
Journal of Electronic Testing, 2003This paper discusses the use of temperature as a test observable for analogue circuits, presenting a generic configuration for analogue circuit thermal testing. As a case study, static temperature analysis is performed over a two-stage operational amplifier in view of extracting temperature waveforms at different locations on the circuit under test ...
J. Altet, A. Ivanov, A. Wong
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High Temperature Digital and Analogue Integrated Circuits in Silicon Carbide
Materials Science Forum, 2013Silicon Carbide devices are capable of operating as a semiconductor at high temperatures and this capability is being exploited today in discrete power components, bringing system advantages such as reduced cooling requirements [1]. Therefore there is an emerging need for control ICs mounted on the same modules and being capable of operating at the ...
R.A.R. Young +7 more
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Electrothermal Simulation of Analogue Integrated Circuits With Ets
1997Nowadays, high-power devices are integrated together with complex digital and high performance analogue circuits on the same chip. Inappropriate design and/or layout cause major problems with maximum temperature and temperature gradients between components.
W. van Petegem, B. Geeraerts, W. Sansen
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