Results 211 to 220 of about 1,482,813 (348)

Roll‐to‐Roll Manufacturing of Flexible Thermoelectric Semiconductors Using Low‐Level Direct‐Current Sputtering

open access: yesAdvanced Materials Technologies, EarlyView.
Roll‐to‐roll direct‐current sputtering enables room‐temperature manufacture of flexible bismuth telluride thermoelectric films. By identifying a low‐power deposition window that suppresses charge‐induced arcing, this work links sputtering conditions to film structure, charge transport, and thermoelectric performance, achieving a room‐temperature figure
Xudong Tao   +5 more
wiley   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane   +4 more
wiley   +1 more source

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

open access: yesAdvanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Machine learning based fault classification for improved induction motor performance. [PDF]

open access: yesPLoS One
Khan ZA   +5 more
europepmc   +1 more source

Characterization and Design Framework for Micro‐ and Nanoscale Printed Metal Interconnects in Hybrid Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
This work establishes a framework for high‐resolution printed interconnects by coupling e‐jet printing control, multilayer deposition, and sintering optimization. Ink properties and printing speed influence particle stacking, while different sintering atmospheres drive distinct microstructural evolution.
Kaifan Yue   +6 more
wiley   +1 more source

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