Results 271 to 280 of about 22,611,724 (309)

Bond Markets, Analysis and Strategies

Southern Economic Journal, 1989
Michael Stutzer, Frank J. Fabozzi, T. Dessa Fabozzi   +2 more
openaire   +1 more source

Analysis for disulfide bonds in peptides and proteins

1987
Publisher Summary This chapter discusses the analysis for disulfide bonds in peptides and proteins. Disulfide bonds make major contributions to the stability of the native conformations of proteins. The determination of the number of disulfide bonds per molecule is therefore crucial to structural studies of proteins.
T W, Thannhauser, Y, Konishi, H A, Scheraga   +2 more
openaire   +2 more sources

A Threat Analysis of Human Bond Communications

Wireless Personal Communications, 2019
In this paper we provide a high-level threat analysis of Human Bond Communications, using the STRIDE methodology. To this end, we provide an overview over Human Bond Communications and define a sample set of cases. The Human Bond Communications cases are such that the threats literally may be existential by nature.
openaire   +2 more sources

A Comparative Analysis of Sukuk and Conventional Bonds

2016
Sukuk and bonds are two kinds of financial instruments; despite their differences, they share similar responsibility of fund mobilizing from surplus (spending) units to shortage units. Sukuk can resemble conventional bonds by some of its features, but it is technically neither debt nor equity.
openaire   +2 more sources

Prenatal Bonding Analysis

2022
György Hidas, Jenő Raffai, Judit Vollner   +2 more
openaire   +1 more source

A crystalline tri-thorium cluster with σ-aromatic metal–metal bonding

Nature, 2021
David Hunger, Ashley Wooles, Stephen Liddle   +2 more
exaly  

A MULTIVARIATE ANALYSIS OF INDUSTRIAL BOND RATINGS

The Journal of Finance, 1973
Pinches, George E, Mingo, Kent A
openaire   +1 more source

Revisiting the Nature of Chemical Bonding in Chalcogenides to Explain and Design their Properties

Advanced Materials, 2023
Matthias Wuttig
exaly  

Recent advances and trends in roll bonding process and bonding model: A review

Chinese Journal of Aeronautics, 2023
Zbigniew Pater, Qingxue Huang, Jianchao Han   +2 more
exaly  

Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer

Applied Surface Science, 2022
Han Wen Hu, Kuan-Neng Chen, Zhong-Jie Hong   +2 more
exaly