Results 81 to 90 of about 23,675,183 (257)

Materials Integrations for High-Performance Photovoltaics by Wafer Bonding [PDF]

open access: yes, 2005
The fundamental efficiency limit for state of the art triple-junction photovoltaic devices is being approached. By allowing integration of non-lattice-matched materials in monolithic structures, wafer bonding enables novel photovoltaic devices that have ...
Zahler, James Michael
core   +1 more source

Chiral separation of chloroalkanes with the chromatographic column onboard Martian rovers

open access: yesFEBS Letters, EarlyView.
Computer image of the Rosalind Franklin Rover of ESA's ExoMars mission. ExoMars is scheduled to land on planet Mars in Oxia Planum in 2029. This area represents an interesting spot to look for biosignatures. Investigations of ExoMars include measurement on molecular chirality. We show that chiral chloroalkanes, that have been identified on Mars, can be
Asma Merzougui   +4 more
wiley   +1 more source

Atmospheric pressure plasma pre-treatment of ALD-Al2O3 for low-temperature direct bonding

open access: yes, 2022
S.85-86This paper presents results of investigations of the bonding behaviour of ALD-Al2O3 coated silicon wafers. Before bonding, the coated wafers were activated with atmospheric-pressure plasma to increase the bonding strength.
Eichler, Marko   +5 more
core   +1 more source

The heterodimeric amino acid transporters (HAT) of the SLC7/SLC3 family: A structure−function relationships and relevance to human pathology

open access: yesFEBS Letters, EarlyView.
Heterodimeric amino acid transporters consist of SLC7 and SLC3 family proteins arranged in a conserved structural organization. They regulate nutrient transport across cell membranes, supporting essential cellular functions. These transporters also contribute to xenobiotic/drug uptake and distribution.
Mariafrancesca Scalise   +5 more
wiley   +1 more source

Modeling of bonding pressure based on the plastic deformation mechanism of interfacial voids closure in solid-state diffusion bonding

open access: yesMaterials & Design
The model of the diffusion bonding pressure was established using the analysis calculation method and further verified by the finite element analysis (FEA) and the experiments.
Yu Peng   +5 more
doaj   +1 more source

(Invited) Glass-Glass Direct Bonding

open access: yes, 2022
S.3-11Glass-glass direct bonding is closely rated to proven processes in Si-Si wafer bonding. We describe plasma-assisted hydrophilic direct bonding of different glass materials for various applications in optical and high precision engineering ...
Zeitner, Uwe   +5 more
core   +1 more source

Leucine‐rich glioma inactivated 1 (LGI1) is a ganglioside‐binding protein

open access: yesFEBS Letters, EarlyView.
Neuronal hyperexcitability associated with a decrease/absence of the extracellular protein LGI1 has been suggested to be primarily due to the downregulation of Kv1 channel expression. The molecular mechanisms underlying this decrease have not yet been elucidated.
Kévin Debreux   +7 more
wiley   +1 more source

Natural Fragment Bond Orbital Method for Inter-Fragment Bonding Interaction Analysis [PDF]

open access: yes
A complex chemical system is often examined based on their fragments, so fragment-based analysis is the key to chemical understanding. We report the natural fragment bond orbital (NFBO) method for inter-fragment bonding interaction analysis, as an ...
Fu Kit, Sheong   +2 more
core   +2 more sources

The ubiquitin system in normal and infected germinal center B cells

open access: yesFEBS Letters, EarlyView.
The ubiquitin system plays a central role in germinal center (GC) B cells, influencing differentiation to long‐lived memory B cells. Oncogenic gammaherpesviruses gain access to memory B cells by establishing latency in GC B cells. Mapping ubiquitin mechanisms in normal and infected GC B cells will define specific molecular circuits in B cells germane ...
Destiny Davis   +2 more
wiley   +1 more source

Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application

open access: yesApplied Sciences, 2019
The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated, and oxygen ...
Hankyeol Seo   +2 more
doaj   +1 more source

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