Results 11 to 20 of about 523 (205)

Etch mechanism of an Al2O3 hard mask in the Bosch process

open access: yesMicro and Nano Engineering, 2022
The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost   +7 more
doaj   +2 more sources

An Electrochemical Haber-Bosch Process [PDF]

open access: yesJoule, 2020
Summary Ammonia, produced via the Haber-Bosch (HB) process, is globally the leading chemical in energy consumption and carbon dioxide emissions. In ammonia plants, hydrogen is generated by steam-methane reforming (SMR) and water-gas shift (WGS) and, subsequently, is purified for the high-pressure ammonia synthesis.
Vasileios Kyriakou   +4 more
openaire   +1 more source

High-throughput screening of suitable nitrogen carriers for chemical looping ammonia synthesis

open access: yesApplications in Energy and Combustion Science, 2023
Chemical looping ammonia synthesis is a promising pathway to synthesise ammonia with lower energy and economic costs than the current Haber-Bosch process, for example, by lowering the operating temperature and/or pressure, whilst maintaining comparable ...
Reinaldo Juan Lee Pereira   +2 more
doaj   +1 more source

Beyond Soil Inoculation: Cyanobacteria as a Fertilizer Replacement

open access: yesNitrogen, 2023
Nitrogen-fixing bacteria such as cyanobacteria have the capability to fix atmospheric nitrogen at ambient temperature and pressure, and intensive cultivation of cyanobacteria for fertilizer could lead to its use as an “environmentally friendly ...
Michael S. Massey, Jessica G. Davis
doaj   +1 more source

Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

open access: yesMicromachines, 2021
Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt   +4 more
doaj   +1 more source

Achieving volatile potassium promoted ammonia synthesis via mechanochemistry

open access: yesNature Communications, 2023
Potassium oxide (K2O) is used as a promotor in industrial ammonia synthesis, although metallic potassium (K) is better in theory. The reason K2O is used is because metallic K, which volatilizes around 400 °C, separates from the catalyst in the harsh ...
Jong-Hoon Kim   +11 more
doaj   +1 more source

Thin-Film Polyimide Membrane Actuators Fabricated by Etching a Substrate by DRIE (Bosch Process)

open access: yesJournal of Advanced Mechanical Design, Systems, and Manufacturing, 2012
This paper deals with thin-film polyimide membrane actuators. The membranes were fabricated by deep-RIE using the Bosch process for etching a silicon substrate up to the polyamide layer, since we found that the polyimide layer was scarcely etched in this
Satomitsu IMAI   +2 more
doaj   +1 more source

Etching technique of high aspect ratio silicon trenches based on CMOS-MEMS process

open access: yesDianzi Jishu Yingyong, 2018
Etching technique of deep silicon trenches with high aspect ratio is critical in improving integration and accuracy of Micro-Electro-Mechanical Systems(MEMS)sensor array and reducing the cost of it.
Zhang Haihua, Lv Yufei, Lu Zhongxuan
doaj   +1 more source

Accessing Low-Valent Titanium CCC-NHC Complexes: Toward Nitrogen Fixation

open access: yesInorganics, 2021
The dramatic expansion of the earth’s population can be directly correlated with the Haber–Bosch process for nitrogen fixation becoming widely available after World War II.
Sriloy Dey, T. Keith Hollis
doaj   +1 more source

Experimental Investigation on Heat Transfer Enhancement with Passive Inserts in Flat Tubes in due Consideration of an Efficiency Assessment

open access: yesFluids, 2022
This paper presents results of an experimental investigation on pressure drop and heat transfer for a wide range of Reynolds and Prandtl numbers ranging from 8 < Pr < 60 and 40 < Re < 3500, for flat tubes without and with passive inserts.
Dirk Bertsche   +4 more
doaj   +1 more source

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