Results 11 to 20 of about 266,768 (294)

Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes

open access: yesMicromachines, 2023
Micro-optical gyroscopes (MOGs) place a range of components of the fiber-optic gyroscope (FOG) onto a silicon substrate, enabling miniaturization, low cost, and batch processing.
Yuyu Zhang   +9 more
doaj   +1 more source

Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching

open access: yesMicromachines, 2021
The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu   +7 more
doaj   +1 more source

UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

open access: yesSensors, 2021
Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance
Mohammad Al Ktash   +10 more
doaj   +1 more source

A Resolved Simulation Approach to Investigate the Separation Behavior in Solid Bowl Centrifuges Using Material Functions

open access: yesSeparations, 2022
The separation of finely dispersed particles from liquids is a basic operation in mechanical process engineering. On an industrial scale, continuously operating decanter centrifuges are often used, whose separation principle is based on the density ...
Helene Katharina Baust   +4 more
doaj   +1 more source

UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

open access: yesNanomaterials, 2023
As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning.
Christopher A. Dirdal   +8 more
doaj   +1 more source

Exploring how design guidelines benefit design engineers: an international and global perspective

open access: yesDesign Science, 2020
A multitude of design guidelines that are intended to support design engineers with knowledge and information during the embodiment design of physical products have been developed back in the 1980s and 1990s.
Benedikt Reimlinger   +3 more
doaj   +1 more source

Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD

open access: yesMicromachines, 2022
In micro-machined micro-electromechanical systems (MEMS), refilled high-aspect-ratio trench structures are used for different applications. However, these trenches often show keyholes, which have an impact on the performance of the devices. In this paper,
Henk-Willem Veltkamp   +6 more
doaj   +1 more source

High-throughput screening of suitable nitrogen carriers for chemical looping ammonia synthesis

open access: yesApplications in Energy and Combustion Science, 2023
Chemical looping ammonia synthesis is a promising pathway to synthesise ammonia with lower energy and economic costs than the current Haber-Bosch process, for example, by lowering the operating temperature and/or pressure, whilst maintaining comparable ...
Reinaldo Juan Lee Pereira   +2 more
doaj   +1 more source

Beyond Soil Inoculation: Cyanobacteria as a Fertilizer Replacement

open access: yesNitrogen, 2023
Nitrogen-fixing bacteria such as cyanobacteria have the capability to fix atmospheric nitrogen at ambient temperature and pressure, and intensive cultivation of cyanobacteria for fertilizer could lead to its use as an “environmentally friendly ...
Michael S. Massey, Jessica G. Davis
doaj   +1 more source

Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

open access: yesMicromachines, 2021
Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt   +4 more
doaj   +1 more source

Home - About - Disclaimer - Privacy