Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching [PDF]
Micromachines, 2021 The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu +7 more
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Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE) [PDF]
Micromachines, 2021 Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt +4 more
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Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching [PDF]
Micromachines, 2020 The key optical components of X-ray grating interferometry are gratings, whose profile requirements play the most critical role in acquiring high quality images.
Zhitian Shi +3 more
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Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication [PDF]
Micromachines, 2020 Quartz is widely used in microelectromechanical systems (MEMS). Especially, MEMS quartz resonators are applied to sensors and serve as sensitive elements. The capability of deep etching is a limitation for the application.
Bo Li +4 more
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AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder [PDF]
Microsystems & NanoengineeringDeep reactive ion etching (DRIE) is critical for fabricating high-aspect-ratio structures in microelectromechanical systems (MEMS), yet its complex, parameter-dependent process poses significant optimization challenges.
Fang Wang +6 more
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Molecular dynamics simulation of atomic layer etching for sidewall damage recovery in GaN-based structures [PDF]
Scientific ReportsToday, as GaN-based devices are becoming increasingly smaller, dry etching has been employed, but it has caused damage, particularly in InGaN/GaN multiple quantum well (MQW) structures exposed to Cl2-based reactive ion etching (RIE).
Eun Koo Kim +13 more
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Advances in Mechanical Engineering, 2017 This study empirically investigates the influences of several parameters on surface morphology and etch rate in a high-aspect-ratio silicon etching process. Two function formulas were obtained, revealing the relationship between the controlled parameters
Tiantong Xu +4 more
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Micromachines, 2021 This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology ...
Michael Huff
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Development of Micron Sized Photonic Devices Based on Deep GaN Etching
Photonics, 2021 In order to design and development efficient III-nitride based optoelectronic devices, technological processes require a major effort. We propose here a detailed review focussing on the etching procedure as a key step for enabling high date rate ...
Karim Dogheche +3 more
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Redeposition-Free Deep Etching in Small KY(WO4)2 Samples
Micromachines, 2020 KY(WO4)2 is a promising material for on-chip laser sources. Deep etching of small KY(WO4)2 samples in combination with various thin film deposition techniques is desirable for the manufacturing of such devices.
Simen Mikalsen Martinussen +3 more
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