Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE) [PDF]
Micromachines, 2021 Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt +4 more
doaj +10 more sources
Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching [PDF]
Micromachines, 2021 The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu +7 more
doaj +10 more sources
Towards the Fabrication of High-Aspect-Ratio Silicon Gratings by Deep Reactive Ion Etching [PDF]
Micromachines, 2020 The key optical components of X-ray grating interferometry are gratings, whose profile requirements play the most critical role in acquiring high quality images.
Zhitian Shi +3 more
doaj +3 more sources
Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication [PDF]
Micromachines, 2020 Quartz is widely used in microelectromechanical systems (MEMS). Especially, MEMS quartz resonators are applied to sensors and serve as sensitive elements. The capability of deep etching is a limitation for the application.
Bo Li +4 more
doaj +3 more sources
Atomic Force Microscopy (AFM)-Based Metrology for Advanced Etching in Three-Dimensional Integrated Circuits [PDF]
MicromachinesFueled by the push for “More than Moore”, three-dimensional integrated circuits (3D ICs) have become a backbone of next-generation electronics. Their complex architectures place unprecedented demands on etching technologies, which must now deliver atomic
Jing Chang +4 more
doaj +2 more sources
AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder [PDF]
Microsystems & NanoengineeringDeep reactive ion etching (DRIE) is critical for fabricating high-aspect-ratio structures in microelectromechanical systems (MEMS), yet its complex, parameter-dependent process poses significant optimization challenges.
Fang Wang +6 more
doaj +2 more sources
Molecular dynamics simulation of atomic layer etching for sidewall damage recovery in GaN-based structures [PDF]
Scientific ReportsToday, as GaN-based devices are becoming increasingly smaller, dry etching has been employed, but it has caused damage, particularly in InGaN/GaN multiple quantum well (MQW) structures exposed to Cl2-based reactive ion etching (RIE).
Eun Koo Kim +13 more
doaj +2 more sources
Simulations of Novel Semi-Spherical Electrode Detectors Formed by Simultaneously Deep-Etched Trenches [PDF]
MicromachinesA novel 3D detector with a semi-spherical electrode detector structure is proposed in this study. The semi-spherical electrode is formed by concentric deep circular-type trenches of varying depths.
Hongfei Wang, Zheng Li
doaj +2 more sources
Advances in Mechanical Engineering, 2017 This study empirically investigates the influences of several parameters on surface morphology and etch rate in a high-aspect-ratio silicon etching process. Two function formulas were obtained, revealing the relationship between the controlled parameters
Tiantong Xu +4 more
doaj +2 more sources
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Micromachines, 2021 This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology ...
Michael Huff
doaj +1 more source