Results 31 to 40 of about 8,725 (286)

Thermal scanning probe lithography using Parylene C as thermal resist

Micro & Nano Letters, 2022
Thermal scanning probe lithography is a direct‐write patterning method that uses a heated scanning probe tip to remove thermal resist. The most widely used thermal resist is polyphthalaldehyde. Another alternative thermal resist, Parylene C is introduced
Yun Jiang, Kevin Dodds, Camelia Dunare, Peter Lomax, Rebecca Cheung   +4 more
doaj   +1 more source

Integrated Nano Liquid Chromatography System On-a-Chip [PDF]

, 2006
Integrated liquid chromatography (LC) chips are valued because of their significant advantages over conventional systems. However, they are very challenging to build due to the high complexity of LC systems and the need for high-level integration of many
He, Qing
core   +1 more source

High-Q trenched aluminum coplanar resonators with an ultrasonic edge microcutting for superconducting quantum devices

Scientific Reports, 2023
Dielectric losses are one of the key factors limiting the coherence of superconducting qubits. The impact of materials and fabrication steps on dielectric losses can be evaluated using coplanar waveguide (CPW) microwave resonators.
E. V. Zikiy, A. I. Ivanov, N. S. Smirnov, D. O. Moskalev, V. I. Polozov, A. R. Matanin, E. I. Malevannaya, V. V. Echeistov, T. G. Konstantinova, I. A. Rodionov   +9 more
doaj   +1 more source

The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials

Nanomaterials
The influence of the etching method on the occurrence of defect levels in InAs/InAsSb type-II superlattice (T2SLs) and MCT photodiode is presented. For both analyzed detectors, the etching process was performed by two methods: wet chemical etching and ...
Kinga Majkowycz, Krzysztof Murawski, Małgorzata Kopytko, Krzesimir Nowakowski-Szkudlarek, Marta Witkowska-Baran, Piotr Martyniuk   +5 more
doaj   +1 more source

A systematic approach to process selection in MEMS [PDF]

, 2006
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from an extensive review of the literature, and ...
Quinn, D.J., Ashby, M.F., Fleck, N.A., Spearing, S.M.   +3 more
core   +1 more source

Periodic arrays of deep nanopores made in silicon with reactive ion etching and deep UV lithography [PDF]

, 2008
We report on the fabrication of periodic arrays of deep nanopores with high aspect ratios in crystalline silicon. The radii and pitches of the pores were defined in a chromium mask by means of deep UV scan and step technology.
Setija, Irwan D., Tjerkstra, R.W., Jansen, Henricus V., Vos, Willem L., Woldering, L.A.   +4 more
core   +1 more source

A new concept for spatially divided Deep Reactive Ion Etching with ALD-based passivation [PDF]

, 2012
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles of 1) Si-etching with SF6 to form gaseous SiFx etch products, and 2) passivation with C4F8 that polymerizes as a protecting fluorocarbon deposit on the ...
Kessels, WMM Erwin, Knaapen, R., Winands, GJJ Hans, Roozeboom, F Fred, Kniknie, BJ Bas, Poodt, P., Knaapen, RJW Raymond, Roozeboom, F., Lankhorst, AM, Dingemans, G., Poodt, P, Kniknie, B.J., Poodt, P.W.G., Smets, Mireille, Keuning, W Wytze, Lankhorst, A.M., Kniknie, B., Kessels, W.M.M., Winands, G.J.J., Dingemans, G Gijs, Winands, G., Smets, M., Keuning, W.   +22 more
core   +2 more sources

Single crystal diamond micro-disk resonators by focused ion beam milling

APL Photonics, 2018
We report on single crystal diamond micro-disk resonators fabricated in bulk chemical vapor deposition diamond plates (3 mm × 3 mm × 0.15 mm) using a combination of deep reactive ion etching and Focused Ion Beam (FIB) milling.
Teodoro Graziosi, Sichen Mi, Marcell Kiss, Niels Quack   +3 more
doaj   +1 more source

Wafer-bonded deep fluidics in BCB with in-plane coupling for lab-on-a-chip applications

Micro and Nano Engineering, 2023
The wafer-scale fabrication of deep channel microfluidics for lab-on-a-chip applications by reactive ion etching and wafer bonding is reported. The microfluidic channels are etched in B-stage bisbenzocyclobutene (BCB) and Cytop with the latter used as a ...
Deepthi Sekhar, Ewa Lisicka-Skrzek, Pierre Berini   +2 more
doaj   +1 more source

Deep Reactive-Ion Etching Process Development and Mask Selection [PDF]

, 2020
Deep reactive-ion etching is an important process in the fabrication of microelectromechanical system devices, through-silicon vias, and dynamic random-access memory capacitors, among other devices and components.
Morse, Ethan
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