Results 31 to 40 of about 6,900 (149)
Wafer-bonded deep fluidics in BCB with in-plane coupling for lab-on-a-chip applications
Micro and Nano Engineering, 2023 The wafer-scale fabrication of deep channel microfluidics for lab-on-a-chip applications by reactive ion etching and wafer bonding is reported. The microfluidic channels are etched in B-stage bisbenzocyclobutene (BCB) and Cytop with the latter used as a ...
Deepthi Sekhar +2 more
doaj +1 more source
An Investigation of Processes for Glass Micromachining
Micromachines, 2016 This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques.
Nguyen Van Toan +2 more
doaj +1 more source
Actuators, 2023 Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentially ...
Junduo Wang +4 more
doaj +1 more source
Micro and Nano EngineeringThis paper presents the fabrication of widely-spaced high aspect ratio ring-shape pillars (i.e. hollow pillars). Lateral etching of the pillars during deep reactive ion etching is challenging.
Wenhan Hu, Zihao Wang, Aixi Pan, Bo Cui
doaj +1 more source
Proceedings, 2017 This paper presents an array of five aluminum nitride (AlN) based piezoelectric micromachined ultrasound transducers (pMUTs) with different dimensions operating at 540–2360 kHz in air.
Sina Sadeghpour +3 more
doaj +1 more source
A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass
Sensors, 2011 This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive
Mohd Haris Md Khir, Hongwei Qu, Peng Qu
doaj +1 more source
Nano-Micro Letters, 2021 Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh +6 more
doaj +1 more source
MicromachinesIn recent years, the field of micro- and nanochannel fabrication has seen significant advancements driven by the need for precision in biomedical, environmental, and industrial applications.
Koosha Karimi +5 more
doaj +1 more source
Micromachines, 2018 Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj +1 more source
Investigation of Deep Trench Process for Trench-gate IGBT
Kongzhi Yu Xinxi Jishu, 2013 Deep trench plasma etch process which is suitable for trench-gate IGBT has been developed based on Lam 4420 reactive ion etching (RIE) tool and Cl2. An undercut-free 6 μm-deep trench with round bottom corners and around 3°sidewall slope is obtained by ...
LUO Haihui +3 more
doaj