Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE) [PDF]
Micromachines, 2021 Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt +4 more
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Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching [PDF]
Micromachines, 2021 The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu +7 more
doaj +4 more sources
Simulations of Novel Semi-Spherical Electrode Detectors Formed by Simultaneously Deep-Etched Trenches [PDF]
MicromachinesA novel 3D detector with a semi-spherical electrode detector structure is proposed in this study. The semi-spherical electrode is formed by concentric deep circular-type trenches of varying depths.
Hongfei Wang, Zheng Li
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Optimization Method for the Synergistic Control of DRIE Process Parameters on Sidewall Steepness and Aspect Ratio [PDF]
MicromachinesDeep Reactive Ion Etching (DRIE), as a key process in silicon micromachining, remains constrained in high-precision applications by sidewall angle deviation and aspect ratio limitations.
Dandan Wang +8 more
doaj +2 more sources
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Micromachines, 2021 This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology ...
Michael Huff
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AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder [PDF]
Microsystems & NanoengineeringDeep reactive ion etching (DRIE) is critical for fabricating high-aspect-ratio structures in microelectromechanical systems (MEMS), yet its complex, parameter-dependent process poses significant optimization challenges.
Fang Wang +6 more
doaj +2 more sources
Fast Analysis of Multilayer Micro-Machined Coupler Based on Mode-Matching Method [PDF]
MicromachinesThe development of next-generation terahertz (THz) transmitters and receivers based on 3D stacked packaging technology relies heavily on the integration of high-performance waveguide directional couplers.
Sheng Li +10 more
doaj +2 more sources
Fabrication of Air Cavity Structures Using DRIE for Acoustic Signal Confinement in FBAR Devices [PDF]
MicromachinesAcoustic energy penetrates into the Si substrate at cavity boundaries. Due to this, the air cavity-based bulk acoustic resonators experience higher harmonic mode, parasitic resonance, and spurious mode.
Raju Patel +3 more
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A Fabrication Method for Realizing Vertically Aligned Silicon Nanowires Featuring Precise Dimension Control [PDF]
SensorsSilicon nanowires (SiNWs) have garnered considerable attention in the last few decades owing to their versatile applications. One extremely desirable aspect of fabricating SiNWs is controlling their dimensions and alignment.
Sourav Mukherjee +3 more
doaj +2 more sources
The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
doaj +1 more source