Results 41 to 50 of about 1,971 (139)

New DRIE-Patterned Electrets for Vibration Energy Harvesting

EPJ Web of Conferences, 2012
This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH).
Chaillout J.-J., Duret A.-B., Boisseau S., Despesse G.   +3 more
doaj   +1 more source

Flexible Wide Bandgap Electrode System for In situ Cell Sensing and Irreversible Electroporation

Advanced Materials Interfaces, Volume 13, Issue 16, 18 August 2026.
The paper reports the design and wafer‐level microfabrication of a long‐lived, flexible 3C‐SiC electrode capable of sensitive and in situ cell sensing, as well as electroporation ablation. The work demonstrates a biocompatible and durable electrode platform that can perform reliable electrical interfacing with biological tissues over extended periods ...
Minh Anh Huynh, Sharda Yadav, Tuan‐Khoa Nguyen, Nam‐Trung Nguyen   +3 more
wiley   +1 more source

Fabrication of adhesive lenses using free surface shaping [PDF]

Journal of the European Optical Society-Rapid Publications, 2013
Two approaches for fabricating polymer lenses are presented in this paper. Both are based on filling circular holes with UV curing adhesives. Initially, the viscous adhesive material creates a liquid and spherical free surface due to its own surface ...
Hoheisel D., Kelb C., Wall M., Roth B., Rissing L.   +4 more
doaj   +1 more source

Quasi‐Standard Platform of AlScN Piezoelectric Integrated MEMS Technology (PIMT) For Multi‐Project Wafer Fabrication

Advanced Sensor Research, Volume 5, Issue 8, August 2026.
This report presents an 8‐inch quasi‐standard piezoelectric integrated MEMS technology (PIMT) platform which, through the integration of core and additional processes, reliably supports three rounds of multi‐project wafer (MPW) fabrication. Whilst ensuring support for mass production processes, the platform offers certain flexibility, providing a ...
Yongquan Su, Yuqiang Hu, Xingwang Zhu, Wenli Xue, Hao Huang, Yichen Liu, Jiachen Han, Anna Li, Cheng Zhang, Wanzhu Qiao, Jiaqi Huang, Peng Ding, Qianying Sun, Huan Liu, Tao Wu, Lihao Wang, Yang Wang, Hao Chen, Zhenyu Wu   +18 more
wiley   +1 more source

Low-cost piezo-MEMS speaker technology

Micro and Nano Engineering, 2023
In this paper, we are reporting low-cost piezo-MEMS speakers based on an SOI-free process. The speaker membrane is made of a 1.5 μm thick polyimide passive layer, obviating the need for SOI wafers. The custom-made PZT solution for depositing 1 μm sol-gel
Sanjog Vilas Joshi, Sina Sadeghpour, Michael Kraft   +2 more
doaj   +1 more source

Miniaturized Bidirectional Thermal Stimulation System Integrated With an Electrode Array for Recording Neural Activities

Advanced Science, Volume 13, Issue 44, 7 August 2026.
This study presents a miniaturized bidirectional thermal stimulation system integrated with an electrode array enabling real‐time, bidirectional modulation and simultaneous recording of neural activity through localized heating and cooling. By monolithic integration of the Peltier element and with a silicon neural probe, the innovative system allows ...
Zoia Naumkina, Kanghwan Kim, Wesley Charles Smith, Keuntae Kim, Shinwoo Lee, Jiwan Woo, Il‐Joo Cho   +6 more
wiley   +1 more source

An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor Components

IEEE Access, 2020
This paper presents a versatile and precise graphene patterning technique using the combined process of masking and inkjet printing. A graphene-based structure is fabricated by first defining the structural pattern and position using a masking mold ...
Yu-Min Fu, Meng-Chuin Chou, Che-Hao Kang, Yu-Ting Cheng, Pu-Wei Wu, Guan-Yu Chen, Ethan B. Secor, Mark C. Hersam   +7 more
doaj   +1 more source

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Metals, 2021
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung   +4 more
doaj   +1 more source

Redefining Crystalline Silicon: Unlocking New Horizons in Transparent and Flexible Photovoltaics

Advanced Energy Materials, Volume 16, Issue 30, 12 August 2026.
Crystalline silicon is presented as a platform for transparent and flexible photovoltaics. This review article outlines design principles for optical strategies to fabricate transparent silicon solar cells, mechanical strategies that mitigate silicon brittleness, and emerging concepts such as singlet‐fission spectral conversion and tandem architectures,
Kangmin Lee
wiley   +1 more source

Design and Fabrication of Complex Micro–Nano Structures for Osteogenesis Interfacing in 3D

Small Structures, Volume 7, Issue 8, August 2026.
The graphical abstract demonstrates the 3D Si structure platforms and the cell interactions. (left) Si structures including wine glass‐, obelisk‐, and pillar‐shaped structures are fabricated at wafer scale. (right) Compare to planar Si substrate, the wine glass‐shaped structures demonstrated promising cellular behavior and osteogenesis guidance by ...
Xuanrui Zhou, Yahui Pan, Thomas Grap, Sven Ingebrandt, Ziyu Gao   +4 more
wiley   +1 more source