Results 51 to 60 of about 2,694 (179)
Deep Reactive Ion Etching of Silicon
, 1998 The ability to etch deep trenches in silicon while controlling not only the profile of etched features but also the etching rate, uniformity and selectivity enable us to expand the number and scope of MEMS devices.
K. A. Lohner +5 more
core +1 more source
Metals, 2021 With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed ...
Do Hoon Cho +4 more
doaj +1 more source
Recent progress on the development of hydrogel‐based microneedles for transdermal drug delivery
VIEW, EarlyView.This study provides a comprehensive and up‐to‐date analysis of recent progress in HMN technology, covering fundamental transdermal delivery mechanisms and design principles, biomaterials used in HMN fabrication, drug loading and release strategies, and emerging therapeutic applications.
Mohammad Muhtasim Ittisaf +5 more
wiley +1 more source
A THREE-STEP MODEL OF BLACK SILICON FORMATION IN DEEP REACTIVE ION ETCHING PROCESS
, 2015 A three-step model used for modeling and simulation of black silicon formation in DRIE (Deep Reactive Ion Etching) process is presented. It divides the plasma etching system into plasma layer, sheath layer and sample surface layer.
Xiaosheng Zhang +9 more
core +1 more source
, 2020 The shape and dimensions of an atomic force microscope tip are crucial factors to obtain high resolution images at the nanoscale. When measuring samples with narrow trenches, inclined sidewalls near 90 degrees or nanoscaled structures, standard silicon ...
Mills, CA +5 more
core +2 more sources
An Inkjet Printing Technique for Scalable Microfabrication of Graphene-Based Sensor Components
IEEE Access, 2020 This paper presents a versatile and precise graphene patterning technique using the combined process of masking and inkjet printing. A graphene-based structure is fabricated by first defining the structural pattern and position using a masking mold ...
Yu-Min Fu +7 more
doaj +1 more source
Low-cost piezo-MEMS speaker technology
Micro and Nano Engineering, 2023 In this paper, we are reporting low-cost piezo-MEMS speakers based on an SOI-free process. The speaker membrane is made of a 1.5 μm thick polyimide passive layer, obviating the need for SOI wafers. The custom-made PZT solution for depositing 1 μm sol-gel
Sanjog Vilas Joshi +2 more
doaj +1 more source
Cyclic Olefin Copolymers as Versatile Materials for Advanced Engineering Applications
Advanced Functional Materials, Volume 36, Issue 47, 11 June 2026.Cyclic olefin copolymers (COCs) are presented as highly versatile materials combining tunable synthesis, excellent optical properties, and mechanical robustness. Their potential spans microfluidics, bioengineering, and advanced electronics, while emerging self‐healing and sustainable solutions highlight future opportunities.
Giulia Fredi +3 more
wiley +1 more source
Silicon Deep Reactive Ion Etching with aluminum hard mask
, 2019 Silicon Deep Reactive Ion Etching (DRIE) process using a multi-layer mask containing a sputtered Aluminum thin film is studied. Aluminum is a candidate for very high aspect ratio DRIE, due to tis very low etch rate, but its adoption is hindered by the ...
Alvise Bagolini +3 more
core +1 more source
Intranasal Delivery of Bacterial Extracellular Vesicles Enables RNA Cargo Entry Into the Brain
Journal of Extracellular Vesicles, Volume 15, Issue 6, June 2026.ABSTRACT Extracellular vesicles (EVs) released by bacteria are potent mediators of host–microbe interactions. They modulate immune responses, deliver functional molecules and influence disease progression. However, whether bacterial EVs can access the brain and functionally affect host cells remains unclear.
Jae Yeong Ha +8 more
wiley +1 more source