Results 71 to 80 of about 2,694 (179)

Skin‐Interfaced Therapeutic Patches for Wound Fluid Management and Transdermal Drug Delivery

open access: yesAdvanced Healthcare Materials, Volume 15, Issue 13, 3 April 2026.
This study presents an integrated skin‐interfaced device combining microfluidics, hydrogel film technology, flexible electronics, and iontophoresis‐based transdermal delivery of PDRN to enhance wound healing. The device effectively manages wound fluid, maintains optimal moisture, and non‐invasively delivers therapeutic drugs.
Dongjun Han   +5 more
wiley   +1 more source

Fabrication of crystalline silicon nanowire arrays using deep reactive ion etching process

open access: yes, 2022
Nanostructures have fascinating physical properties that the bulk material doesn???t exhibit. Especially, the optical and electrical properties of silicon nanowires (SiNWs) have attracted much attention for application in various devices such as solar ...
Seo, Kwanyong, Lee, Jungtaek
core  

Poking Pluripotency: Nanoinjection Into Human iPSCs

open access: yesAdvanced Materials, Volume 38, Issue 20, 7 April 2026.
Nanoinjection into hiPSCs: silicon nanotubes effectively transfect human induced pluripotent stem cells (hiPSCs) with mRNA, enabled by a delayed extracellular matrix application and enhanced surface functionalization. Nanoinjection is demonstrated with several reporter mRNA, including co‐transfection of mCherry and GFP.
Jann Harberts   +5 more
wiley   +1 more source

Deep reactive ion etching of in situ boron doped LPCVD Ge0.7Si0.3 using SF6 and O2 plasma [PDF]

open access: yes, 2013
This paper reports on deep reactive ion etching (DRIE) of in situ highly boron doped low pressure chemical vapor deposited Ge0.7Si0.3 alloy in SF6 and O2 plasma.
Salm, Cora   +2 more
core   +1 more source

Ultrafast Photocatalytic Wettability Switching in Substrate‐Interface Tailored Titanium Dioxide Thin Films

open access: yesAdvanced Materials Interfaces, Volume 13, Issue 7, 7 April 2026.
This study demonstrates ultrafast photocatalytic wettability switching in TiO2 thin films by tailoring substrate doping and interface oxides. Enhanced switching rates and hemiwicking effects are achieved through optimized material stacks and nanostructuring.
Rucha A. Deshpande   +6 more
wiley   +1 more source

Optimization of deep reactive ion etching process

open access: yes, 2019
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the ...
Houška, David
core  

Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures

open access: yesMicromachines, 2018
A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using micromachined tungsten-coated through glass silicon via (TGSV) structures.
Ik-Jae Hyeon, Chang-Wook Baek
doaj   +1 more source

Sub‐100 Nanometer Focusing of Hard X‐rays Using SU‐8 Compound Kinoform Focusing Lenses

open access: yesAdvanced Photonics Research, Volume 7, Issue 4, April 2026.
A novel aberration‐free X‐ray compound refractive lens design based on Cartesian oval curve is presented. Achieving a vertical focal spot size of 70.8 nm using knife‐edge scanning with a 200 μm incident aperture. Wavefront reconstruction via knife‐edge imaging further resolves a refined focal spot of 56 nm.
Yuanze Xu   +12 more
wiley   +1 more source

Safe and Efficient CRISPR Genome Editing of Primary Human T Cells Using a Droplet‐Based Cell Mechanoporation Platform

open access: yesSmall, Volume 22, Issue 19, 1 April 2026.
This study introduces a microfluidic droplet mechanoporation system for the engineering of primary human T cells. The platform enables efficient, scalable, and robust delivery of mRNA for CAR T cell production and CRISPR‐Cas9 ribonucleoproteins for genome editing, while maintaining high cell viability.
You‐Jeong Kim   +2 more
wiley   +1 more source

Concept of Spatially-Divided Deep Reactive Ion Etching of Si using Oxide Atomic Layer Deposition in the Passivation Cycle

open access: yes, 2012
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles of 1) Si-etching with SF6 to form gaseous SiFx etch products, and 2) passivation with C4F8 that polymerizes as a protecting fluorocarbon deposit on the ...
G. Dingemans   +20 more
core   +1 more source

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