Results 71 to 80 of about 1,971 (139)

Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications

Advanced Electronic Materials
Integrating piezoelectric materials onto the vertical surfaces of microelectromechanical systems (MEMS) microstructures enables three‐dimensional piezoelectric (3D piezoMEMS) devices, providing multi‐axis sensing and actuation capabilities with a reduced
Arsam Ali, Glenn Ross, Mervi Paulasto‐Kröckel   +2 more
doaj   +1 more source

Fabrication and Characterization of Silicon Micro-Funnels and Tapered Micro-Channels for Stochastic Sensing Applications

Sensors, 2008
We present a simplified, highly reproducible process to fabricate arrays of tapered silicon micro-funnels and micro-channels using a single lithographic step with a silicon oxide (SiO2) hard mask on at a wafer scale.
Frances S. Ligler, Marie J. Archer
doaj  

Side-wall metallization process for enhanced electrical contact in SOI-based MEMS switches

Micro and Nano Engineering
MEMS inertial switches provide a zero-power alternative to conventional accelerometers by mechanically closing an electrical contact only when a specific acceleration threshold is exceeded.
Inês S. Garcia, Filipa C. Mota, Jorge M. Pereira, Fahimullah Khan, Carlos Ferreira, Jorge Cabral, José Fernandes, Carlos Calaza, Rosana A. Dias, Filipe S. Alves   +9 more
doaj   +1 more source

PATTERN DENSITY BASED PREDICTION FOR DEEP REACTIVE ION ETCH (DRIE)

2004 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2004
T.F. Hill, H. Sun, H. Taylor, M. Schmidt, D. Boning   +4 more
openaire   +1 more source

Ultra Deep Anisotropic Silicon Trenches Using Deep Reactive Ion Etching (DRIE)

2000 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2000
A.A. Ayón, X. Zhang, R. Khanna
openaire   +1 more source

Precision Fabrication of High-Speed Micro-Rotors using Deep Reactive Ion Etching (DRIE)

2002 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2002
N. Miki, C.J. Teo, L. Ho, X. Zhang
openaire   +1 more source

Suspended Germanium-on-Silicon Photonic Integrated Circuits Operating in the Long-Wave Infrared and Their Use for Ethanol Sensing. [PDF]

ACS Photonics
Lin PS, Hellström PE, Zervos C, Niklaus F, Gylfason KB.   +4 more
europepmc   +1 more source

Atomic Force Microscopy (AFM)-Based Metrology for Advanced Etching in Three-Dimensional Integrated Circuits. [PDF]

Micromachines (Basel)
Chang J, Wang S, Liang S, Feng X, Zhao W.   +4 more
europepmc   +1 more source

Design and Development of Sc_0.2Al_0.8N-Based Dual-Piezoelectric-Layer MEMS Hydrophone. [PDF]

Micromachines (Basel)
Cui D, Duan X, Guan Z, Hu N, Guo Y, Yao Y, Yan H, Xue C.   +7 more
europepmc   +1 more source

Frequency-angle decoupling design for grid-etched piezoelectric MEMS cantilevers and its application to quasi-static micromirrors. [PDF]

Microsyst Nanoeng
Xue W, Su Y, Qiao W, Liu Y, Yang Y, Zhao H, Zhang P, Shen G, Chen H, Wang Y, Wu Z, Wang L.   +11 more
europepmc   +1 more source