Results 61 to 70 of about 2,694 (179)
Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
MicromachinesAdvances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz ...
Xinghui Li, Jinjun Feng
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Sensors, 2017 In the following paper, we present an industry perspective of inertial sensors for navigation purposes driven by applications and customer needs.
Olaf Deppe +5 more
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Small, Volume 22, Issue 32, 8 June 2026.Wafer‐scale top‐down fabrication yields silicon nanoparticles with exceptional uniformity (CV 1.7%–2.4%), enabling deterministic axis‐ratio tuning. At AR ≈$\approx$ 2.1, electric–magnetic dipoles overlap on‐resonance, producing near‐Kerker forward scattering (F/B ≈$\approx$ 12.5).
Taeyeong Kim, Jungchul Lee
wiley +1 more source
MicromachinesIn recent years, the field of micro- and nanochannel fabrication has seen significant advancements driven by the need for precision in biomedical, environmental, and industrial applications.
Koosha Karimi +5 more
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A Fast, Large-Stroke Electrothermal MEMS Mirror Based on Cu/W Bimorph
Micromachines, 2015 This paper reports a large-range electrothermal bimorph microelectromechanical systems (MEMS) mirror with fast thermal response. The actuator of the MEMS mirror is made of three segments of Cu/W bimorphs for lateral shift cancelation and two segments of ...
Xiaoyang Zhang, Liang Zhou, Huikai Xie
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Quasi‐Static to Supersonic Energy Absorption of Nanoarchitected Tubulanes and Schwarzites
Advanced Functional Materials, Volume 36, Issue 39, 14 May 2026.Nanoarchitected energy‐absorptive Tubulanes exhibit record energy absorption under quasi‐static conditions and exceptional inelastic energy dissipation under 750 m s−1 ballistics impact, with high performance spanning strain rates of 12 orders of magnitude.
Peter Serles +16 more
wiley +1 more source
Fabrication of sub-micron silicon vias by deep reactive ion etching
, 2005 Deep reactive ion etching (DRIE) is a major microfabrication process for micro-electro-mechanical system (MEMS) devices. In recent years DRIE is also applied to make through-silicon-vias (TSVs) for 3D packaging.
Ricky Lee, S. W. +2 more
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Electrostatic Comb-Drive Actuator with High In-Plane Translational Velocity
Micromachines, 2016 This work reports the design and opto-mechanical characterization of high velocity comb-drive actuators producing in-plane motion and fabricated using the technology of deep reactive ion etching (DRIE) of silicon-on-insulator (SOI) substrate.
Yomna M. Eltagoury +4 more
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Hybrid Heterostructures of Nanostructured Si Membrane and MoS2 for Self‐Powered Photodetectors
Advanced Electronic Materials, Volume 12, Issue 10, 25 May 2026.A scalable MoS2/Si nanomesh vertical heterostructure is developed for self‐powered photodetection. The nanostructured junction enhances conductivity, expands the active heterointerface, and enables a transition from photovoltaic to avalanche‐assisted operation, delivering markedly improved photoresponse over planar counterparts.
Jingying Liu +8 more
wiley +1 more source
Profile Control of a Borosilicate-Glass Groove Formed by Deep Reactive Ion Etching [PDF]
, 2007 Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall
Akashi, T., Yoshimura, Y.
core