Results 81 to 90 of about 2,694 (179)
Sub-Millimeter-Wave 10 dB Directional Coupler Based on Micromachining Technique
A waveguide 10 dB directional coupler operating from 325 GHz to 400 GHz is designed based on the short-slot Riblet-type coupling configuration and fabricated using the deep reactive ion etching (DRIE) silicon micromachining technique.
Shuang Liu +6 more
doaj +1 more source
One of the major challenges faced by the biomedical industry is the development of robust synthetic surfaces that can resist bacterial colonization. Much inspiration has been drawn recently from naturally occurring mechano-bactericidal surfaces such as ...
Chris M. Bhadra +11 more
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Fabrication of superhydrophobic wide-band 'black silicon' by deep reactive ion etching
This paper presents a fabrication technology of 'Black Silicon' with superhydrophobicity and wide-band properties based on an improved deep reactive ion etching (DRIE).
Zhang, Hai-Xia +7 more
core +1 more source
Reactive ion etching of 4H-SiC using SF6/O2 for MEMS application [PDF]
Deep Reactive Ion Etching (DRIE) of 4H-SiC performed using SF6/O2 plasma. The etching rates investigated as a function of the ratio of the O2 flow rate to total gas flow rate under different etching conditions such as the effect of power density ...
Hamidon, Mohd Nizar +1 more
core
Single-step deep reactive ion etching of ultra-deep Silicon cavities with smooth sidewalls
International audiencetA process based on deep reactive ion etching (DRIE) has been developed and optimized for the fabricationof millimeter deep silicon cavities with smooth sidewalls.
Passilly, Nicolas +4 more
core +1 more source
Depth-dependent EBIC microscopy of radial-junction Si micropillar arrays
Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional ...
Kaden M. Powell, Heayoung P. Yoon
doaj +1 more source
Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components
A deep reactive ion etch (DRIE) process for fabrication of high aspect ratio trenches has been developed. Trenches with aspect ratios exceeding 20 and vertical sidewalls with low roughness have been demonstrated. The process has successfully been used in
Jensen, Søren +5 more
core +1 more source
Recently, demands for nanochannels have been increasing in biological and nanofluidic applications. In this paper, a fabrication process that produces a nanochannel with a width of less than 20 nm and a high aspect ratio is proposed.
Jin Han +3 more
core +1 more source
Design, Fabrication and Experiment of Double U-Beam MEMS Vibration Ring Gyroscope
This study presents a new microelectromechanical system, a vibration ring gyroscope with a double U-beam (DUVRG), which was designed using a combination of mathematical analysis and the finite element method.
Huiliang Cao +10 more
doaj +1 more source
This paper focuses on structural optimization of a Butterfly vibratory gyroscope (BFVG). An oblique suspension beam adopting polygonal cross-section is proposed in order to enhance the sensitivity and robustness.
Fenlan Ou +3 more
doaj +1 more source

