Results 101 to 110 of about 2,694 (179)

Development of a Deep Silicon Phase Fresnel Lens using Gray-scale Lithography and Deep Reactive Ion Etching [PDF]

, 2004
A phase Fresnel lens (PFL) could achieve higher sensitivity and angular resolution in astronomical observations than the current generation of gamma and hard x-ray instruments.
Morgan, Brian C., Morgan, Brian
core  

Three step deep reactive ion etch for high density trench etching

, 2016
A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10 μm wide to a depth of 130 μm into silicon with an etch rate of 2.5 μm min−1 . The aim of this process is to obtain sidewalls with an angle close to 90°.
Puers, Bob, Lips, Bram
core   +1 more source

Fabrication and Characterization of Silicon Micro-Funnels and Tapered Micro-Channels for Stochastic Sensing Applications

Sensors, 2008
We present a simplified, highly reproducible process to fabricate arrays of tapered silicon micro-funnels and micro-channels using a single lithographic step with a silicon oxide (SiO2) hard mask on at a wafer scale.
Frances S. Ligler, Marie J. Archer
doaj  

Side-wall metallization process for enhanced electrical contact in SOI-based MEMS switches

Micro and Nano Engineering
MEMS inertial switches provide a zero-power alternative to conventional accelerometers by mechanically closing an electrical contact only when a specific acceleration threshold is exceeded.
Inês S. Garcia, Filipa C. Mota, Jorge M. Pereira, Fahimullah Khan, Carlos Ferreira, Jorge Cabral, José Fernandes, Carlos Calaza, Rosana A. Dias, Filipe S. Alves   +9 more
doaj   +1 more source

PATTERN DENSITY BASED PREDICTION FOR DEEP REACTIVE ION ETCH (DRIE)

2004 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2004
T.F. Hill, H. Sun, H. Taylor, M. Schmidt, D. Boning   +4 more
openaire   +1 more source

Die separation strength for deep reactive ion etched wafers.

, 2010
In the electronic and microfabrication industry, die separation is one of the most critical steps in producing an undamaged, stand-alone micro-scale device.
Porter, Daniel Allen
core   +1 more source

An optical MEMS accelerometer fabricated using double-sided deep reactive ion etching on silicon-on-insulator wafer

, 2017
Optical MEMS devices provide fast detection, electromagnetic resilience and high sensitivity. Using this technology, an optical gratings based accelerometer design concept was developed for seismic motion detection purposes that provides miniaturization,
Yong-Jin Yoon, Say Hwa Tan, Adrian J T Teo, Tan, Say Hwa, Teo, Adrian J T, Li, Holden, Yoon, Yong-Jin, Holden Li, Teo, Adrian JT   +8 more
core   +1 more source

Ultra Deep Anisotropic Silicon Trenches Using Deep Reactive Ion Etching (DRIE)

2000 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2000
A.A. Ayón, X. Zhang, R. Khanna
openaire   +1 more source

Particle Swarm Optimization of Model Parameters: Simulation of Deep Reactive Ion Etching by the Continuous Cellular Automaton

, 2013
As a widespread form of Deep Reactive Ion Etching (DRIE), the Bosch process alternates etching and passivation cycles, typically leading to characteristic scalloping patterns on the sidewalls.
Gosalvez, M A, Y. Li, Y. Xing, Xing, Y, Li, Y, Prem Pal, Y. Zhou, Pal, Prem, Zhou, Y, M. A. Gosalvez, Pal, P   +10 more
core   +1 more source

Fabrication of vertical silicon microwire arrays for enhanced light trapping using Deep Reactive Ion Etching

, 2014
Silicon microwire array is one of the promising platforms as a means for developing highly efficient solar cells thanks to the enhanced light trapping efficiency.
Hwang, Inchan, Um, Han-Don, Seo, Kwanyong   +2 more
core