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AN ultra-low cost deep reactive ion etching (drie) tool for flexible, small volume manufacturing
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015Our goal is to demonstrate that we can achieve a radical reduction in the capital cost of micro/nano-manufacturing without sacrificing performance by scaling production throughput. As a demonstration of this concept, we show for the first time a DRIE system that processes small substrates (∼1 in2) with performance comparable to commercial systems for a
K K Gleason, M A Schmidt
exaly +2 more sources
Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)
MRS Proceedings, 2003ABSTRACTWafer and die level uniformity effects in Deep Reactive Ion Etching (DRIE) are quantitatively modeled and characterized. A two-level etching model has been developed to predict non-uniformities in high-speed rotating microstructures. The separation of wafer level and die level effects is achieved by sequentially etching wafers with uniformly ...
Hongwei Sun +3 more
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MRS Proceedings, 1999
AbstractFluorocarbon films are useful as antistiction films for suspended structure and also for electrical isolation purposes. Furthermore, due to their low dielectric constant and ease of deposition they are useful for VLSI manufacturing applications. Thus, in the interest of building a complete database for these plasma generated fluorocarbon films,
A. A. Ayón +5 more
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AbstractFluorocarbon films are useful as antistiction films for suspended structure and also for electrical isolation purposes. Furthermore, due to their low dielectric constant and ease of deposition they are useful for VLSI manufacturing applications. Thus, in the interest of building a complete database for these plasma generated fluorocarbon films,
A. A. Ayón +5 more
openaire +1 more source
1999
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. ; Includes bibliographical references (p. 89-90). ; by Chi-Fan Yung. ; S.M.
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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. ; Includes bibliographical references (p. 89-90). ; by Chi-Fan Yung. ; S.M.
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Process characterisation of deep reactive ion etching for microfluidic application
International Journal of Nanotechnology, 2018Chien Mau Dang, Dung My Thi Dang
exaly

