Micromachines, 2018 A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution.
Jia-Cheng Yu +6 more
doaj +1 more source
A systematic approach to process selection in MEMS [PDF]
, 2006 A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from an extensive review of the literature, and ...
Quinn, D.J. +3 more
core +1 more source
A new concept for spatially divided Deep Reactive Ion Etching with ALD-based passivation [PDF]
, 2012 Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles of 1) Si-etching with SF6 to form gaseous SiFx etch products, and 2) passivation with C4F8 that polymerizes as a protecting fluorocarbon deposit on the ...
Kessels, WMM Erwin +22 more
core +2 more sources
Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
Proceedings, 2017 This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba +4 more
doaj +1 more source
Cryogenic deep reactive ion etching of silicon micro and nanostructures [PDF]
, 2009 This thesis focuses on cryogenic deep reactive ion etching (DRIE) and presents how it can be applied to the fabrication of silicon micro- and nanostructures that have applications in microfluidics and micromechanics.
Sainiemi, Lauri
core +1 more source
Deep Reactive-Ion Etching Development With the Bosch Process [PDF]
, 2022 The Bosch process is a type of deep reactive-ion etching (DRIE) of silicon. It is a type of plasma etching, or dry etching, that uses physical and chemical processes to etch the surface of a silicon sample.
Pier, Marcelo
core
An Electrostatic MEMS Roll-Pitch Rotation Rate Sensor with In-Plane Drive Mode
Sensors, 2022 In this paper, we presented a novel electrostatic Roll/Pitch MEMS gyroscope with in-plane drive mode and out-of-plane sense mode. The proposed structure is developed based on a tuning fork gyroscope with decoupled sense mass on each tine that control the
Ahmed Khaled +9 more
doaj +1 more source
Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application
Sensors, 2018 MEMS fabrication that is based on the silicon-on-glass (SOG) process requires many steps, including patterning, anodic bonding, deep reactive ion etching (DRIE), and chemical mechanical polishing (CMP).
Zhibo Ma +4 more
doaj +1 more source
A novel deep reactive ion etched (DRIE) glass micro-model for two-phase flow experiments
Lab on a Chip, 2012 In the last few decades, micro-models have become popular experimental tools for two-phase flow studies. In this work, the design and fabrication of an innovative, elongated, glass-etched micro-model with dimensions of 5 × 35 mm(2) and constant depth of 43 microns is described.
Karadimitriou, N.K. +4 more
openaire +4 more sources
Towards high-throughput large-area metalens fabrication using UV-nanoimprint lithography and Bosch deep reactive ion etching [PDF]
, 2020 We demonstrate the fabrication of diffraction-limited dielectric metasurface lenses for NIR by the use of standard industrial high-throughput silicon processing techniques: UV nano imprint lithography (UV-NIL) combined with continuous reactive ion ...
Angelskår, Hallvard +5 more
core +1 more source