Results 21 to 30 of about 11,316 (211)

Fabrication of High-Density Out-of-Plane Microneedle Arrays with Various Heights and Diverse Cross-Sectional Shapes

Nano-Micro Letters, 2021
Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh, Young Jun Yoon, Jin Soo Park, Dong-Hyun Kang, Seung Min Kwak, Byung Chul Lee, Maesoon Im   +6 more
doaj   +1 more source

Towards high-throughput large-area metalens fabrication using UV-nanoimprint lithography and Bosch deep reactive ion etching. [PDF]

Optics Express, 2020
We demonstrate the fabrication of diffraction-limited dielectric metasurface lenses for NIR by the use of standard industrial high-throughput silicon processing techniques: UV nano imprint lithography (UV-NIL) combined with continuous reactive ion ...
Christopher A. Dirdal, G. U. Jensen, H. Angelskår, Paul Conrad Vaagen Thrane, J. Gjessing, Daniel Alfred Ordnung   +5 more
semanticscholar   +1 more source

WAFER-LEVEL HIGH-ASPECT-RATIO DEEP REACTIVE ION ETCHING OF 4H-SILICON CARBIDE ON INSULATOR SUBSTRATES

2022 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2022
This paper reports on the results of high-aspect-ratio (HAR) Deep Reactive Ion Etching (DRIE) of thick 4H-SiC on Insulator (SiCOI) substrates at wafer-level and outlines the progress and challenges.
Ardalan Lotfi, Micheal Hardin, Zhenming Liu, A. Wood, Chris Bolton, Kevin Riddell, Huma Ashraf, J. Carpenter, F. Ayazi   +8 more
semanticscholar   +1 more source

Plasma removal of Parylene C [PDF]

, 2008
Parylene C, an emerging material in microelectromechanical systems, is of particular interest in biomedical and lab-on-a-chip applications where stable, chemically inert surfaces are desired.
Li, Po-Ying, Meng, Ellis, Tai, Yu-Chong
core   +1 more source

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Micromachines, 2018
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj   +1 more source

Design of experiment for the optimisation of deep reactive ion etching of silicon inserts for micro-fabrication [PDF]

, 2012
The following paper describes a design of experiments investigation of the deep reactive of pillar structures on a silicon wafer. The etched wafers would subsequently be used as masters for the fabrication of nickel mould inserts for microinjection ...
Alcock, Jeffrey R., Shaw, Christopher P., Wallis, K.   +2 more
core   +1 more source

Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures [PDF]

, 2002
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employing SF/sub 6//O/sub 2/-based high-density plasmas at cryogenic temperatures.
Boer, Meint J. de, Elwenspoek, Miko, Gardeniers, J.G.E. (Han), Gilde, Melis-Jan, Jansen, Henri V., Roelofs, Gerard, Sasserath, Jay N.   +6 more
core   +2 more sources

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

Micromachines, 2018
A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution.
Jia-Cheng Yu, Zai-Fa Zhou, Jia-Le Su, Chang-Feng Xia, Xin-Wei Zhang, Zong-Ze Wu, Qing-An Huang   +6 more
doaj   +1 more source

Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon

Proceedings, 2017
This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba, Aslihan Arslan, Ronald Stoute, James Muganda, Ronald Dekker   +4 more
doaj   +1 more source

Micromachining of buried micro channels in silicon [PDF]

, 2000
A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper.
Berenschot, J.W. (Erwin), Berg, Albert van den, Boer, Meint J. de, Burger, G.J., Elwenspoek, Miko, Gardeniers, J.G.E. (Han), Jansen, Henri V., Tjerkstra, R. Willem   +7 more
core   +3 more sources