Results 11 to 20 of about 11,316 (211)
Ultra Deep Anisotropic Silicon Trenches Using Deep Reactive Ion Etching (DRIE)
2000 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2000 A.A. Ayón, X. Zhang, R. Khanna
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Precision Fabrication of High-Speed Micro-Rotors using Deep Reactive Ion Etching (DRIE)
2002 Solid-State, Actuators, and Microsystems Workshop Technical Digest, 2002 N. Miki, C.J. Teo, L. Ho, X. Zhang
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Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices [PDF]
MicromachinesAdvances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz ...
Xinghui Li, Jinjun Feng
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The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Micromachines, 2021 This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology ...
Michael Huff
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Automated, deep reactive ion etching free fiber coupling to nanophotonic devices [PDF]
OPTO, 2022 Rapid development in integrated optoelectronic devices and quantum photonic architectures creates a need for optical fiber to chip coupling with low losses.
F. Flassig +8 more
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Micro and Nano Systems Letters, 2020 Deep reactive-ion etching (DRIE) is commonly used for high aspect ratio silicon micromachining. However, scalloping, which is the result of the alternating Bosch process of DRIE, can cause many problems in the subsequent process and degrade device ...
Jin Soo Park +7 more
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A two-level prediction model for deep reactive ion etch (DRIE) [PDF]
18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005., 2005 The authors contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of MEMS devices. Non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and local consumption at the die level.
Taylor, Hayden K. +4 more
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Actuators, 2023 Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentially ...
Junduo Wang +4 more
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Etch mechanism of an Al2O3 hard mask in the Bosch process
Micro and Nano Engineering, 2022 The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost +7 more
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