Simulations of Novel Semi-Spherical Electrode Detectors Formed by Simultaneously Deep-Etched Trenches [PDF]
MicromachinesA novel 3D detector with a semi-spherical electrode detector structure is proposed in this study. The semi-spherical electrode is formed by concentric deep circular-type trenches of varying depths.
Hongfei Wang, Zheng Li
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Optimization Method for the Synergistic Control of DRIE Process Parameters on Sidewall Steepness and Aspect Ratio [PDF]
MicromachinesDeep Reactive Ion Etching (DRIE), as a key process in silicon micromachining, remains constrained in high-precision applications by sidewall angle deviation and aspect ratio limitations.
Dandan Wang +8 more
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AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder [PDF]
Microsystems & NanoengineeringDeep reactive ion etching (DRIE) is critical for fabricating high-aspect-ratio structures in microelectromechanical systems (MEMS), yet its complex, parameter-dependent process poses significant optimization challenges.
Fang Wang +6 more
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Fast Analysis of Multilayer Micro-Machined Coupler Based on Mode-Matching Method [PDF]
MicromachinesThe development of next-generation terahertz (THz) transmitters and receivers based on 3D stacked packaging technology relies heavily on the integration of high-performance waveguide directional couplers.
Sheng Li +10 more
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Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS [PDF]
Advanced Science, Volume 13, Issue 34, 19 June 2026.A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun +10 more
wiley +2 more sources
Fabrication of Air Cavity Structures Using DRIE for Acoustic Signal Confinement in FBAR Devices [PDF]
MicromachinesAcoustic energy penetrates into the Si substrate at cavity boundaries. Due to this, the air cavity-based bulk acoustic resonators experience higher harmonic mode, parasitic resonance, and spurious mode.
Raju Patel +3 more
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A Fabrication Method for Realizing Vertically Aligned Silicon Nanowires Featuring Precise Dimension Control [PDF]
SensorsSilicon nanowires (SiNWs) have garnered considerable attention in the last few decades owing to their versatile applications. One extremely desirable aspect of fabricating SiNWs is controlling their dimensions and alignment.
Sourav Mukherjee +3 more
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Etch mechanism of an Al2O3 hard mask in the Bosch process
Micro and Nano Engineering, 2022 The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost +7 more
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Nano-Micro Letters, 2021 Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh +6 more
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Micromachines, 2018 Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
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