Results 41 to 50 of about 6,900 (149)
Nanoscale Research Letters, 2018 Silicon is widely used in semiconductor industry but has poor performance in near-infrared photoelectronic devices because of its high reflectance and band gap limit.
Hao Zhong +4 more
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Three step deep reactive ion etch for high density trench etching
Journal of Physics: Conference Series, 2016 A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10μm wide to a depth of 130μm into silicon with an etch rate of 2.5μm min-1. The aim of this process is to obtain sidewalls with an angle close to 90°. The process allows the etching of multiple trenches with high aspect ratios that are closely placed together.
Lips, Bram, Puers, Bob
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Micromachines, 2017 This paper reports the design and fabrication of capacitive silicon nanomechanical resonators with the selective vibration of a high-order mode. Fixed-fixed beam capacitive silicon resonators have been successfully produced by the use of electron beam ...
Nguyen Van Toan +4 more
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Optimization of Etching Profile in Deep-Reactive-Ion Etching for MEMS Processes of Sensors
Journal of Sensor Science and Technology, 2015 This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area >
Chung Mo Yang +2 more
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Fabrication and electrochemical characterization of ruthenium nanoelectrodes
Current Directions in Biomedical Engineering, 2017 The Fraunhofer IMS has recently developed a technique for producing nanoelectrodes that are generated by atomic layer deposition (ALD) in a via deep reactive ion etching (DRIE) structured sacrificial layer.
Allani Sonja +4 more
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International Journal of Photoenergy, 2012 For lower reflectance, we applied a maskless plasma texturing technique using reactive ion etching (RIE) on acidic-textured multicrystalline silicon (mc-Si) wafer. RIE texturing had a deep and narrow textured surface and showed excellent low reflectance.
Ji-Myung Shim +12 more
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UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability. [PDF]
Nanomaterials (Basel), 2023 Dirdal CA +8 more
europepmc +1 more source
Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
MicromachinesAdvances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz ...
Xinghui Li, Jinjun Feng
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New DRIE-Patterned Electrets for Vibration Energy Harvesting
EPJ Web of Conferences, 2012 This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH).
Chaillout J.-J. +3 more
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Modelling and Fabrication of Micro-SOFC Membrane Structure
Medžiagotyra, 2014 Fabrication process of micro-SOFC membrane structure using the bulk micromachining of silicon technique with SiO2 and Si3N4 sacrificial layers is presented in this study.
Brigita ABAKEVIČIENĖ +6 more
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