Results 61 to 70 of about 19,615 (204)

Self‐Powered, Ultra‐Sensitive InGaAs/ITO Nanowire Radial Junction Infrared Photodiode for Low Flux Imaging at Room Temperature

Advanced Functional Materials, EarlyView.
This study reports a self‐powered InGaAs nanowire photodetector achieving single‐photon‐level sensitivity in the shortwave infrared at non‐cryogenic temperatures. The device demonstrates high‐speed imaging capabilities even under extremely low‐flux conditions.
Kosala Dhanawansha, Chaohao Chen, Zhe Li, Tuomas Haggren, Dawei Liu, Yang Yu, Baolei Liu, Sanjay Krishna, Hark H. Tan, Chennupati Jagadish, Lan Fu   +10 more
wiley   +1 more source

An Engineered Biomimetic Nanoreactor With Cascade Functions for Targeted and Combinatorial Therapy of Ischemic Stroke

Advanced Healthcare Materials, EarlyView.
Preparation of RVG‐modified erythrocyte membrane‐coated HMPB nanocarriers loaded with L‐arginine and NBP (RM@HPAN) and its neuroprotective mechanism. After intravenous injection, RM@HPAN achieves prolonged circulation, RVG‐29‐mediated BBB penetration, and ischemic accumulation.
Shaofa Li, Ying Wu, Huimin Wei, Jinyong Teng, Zaizhi Yang, Jufang Chen, Bao Liao, Xiaoqin Huang, Lanqing Meng, Tong Li   +9 more
wiley   +1 more source

Fabrication and electrochemical characterization of ruthenium nanoelectrodes

Current Directions in Biomedical Engineering, 2017
The Fraunhofer IMS has recently developed a technique for producing nanoelectrodes that are generated by atomic layer deposition (ALD) in a via deep reactive ion etching (DRIE) structured sacrificial layer.
Allani Sonja, Jupe Andreas, Figge Martin, Goehlich Andreas, Vogt Holger   +4 more
doaj   +1 more source

Enhanced near-infrared absorber: two-step fabricated structured black silicon and its device application

Nanoscale Research Letters, 2018
Silicon is widely used in semiconductor industry but has poor performance in near-infrared photoelectronic devices because of its high reflectance and band gap limit.
Hao Zhong, Nasir Ilyas, Yuhao Song, Wei Li, Yadong Jiang   +4 more
doaj   +1 more source

Microfluidic Engineering of Microgels: A Review of Emerging Technologies, Materials, Fabrication Strategies, and Applications

Advanced Healthcare Materials, EarlyView.
Recent advances in microfluidic technologies for microgel fabrication are critically reviewed, highlighting the capabilities and limitations of major microfluidic platforms and discussing how platform design, material selection, and crosslinking strategies influence microgel architecture and functionality. Current challenges and future opportunities in
Afshin Abrishamkar, Laura Neely, Cynthia Pham, Nada Ibrahim, Alexis Larios‐Cervantes, Ben A. Kertesz, Todd Hoare   +6 more
wiley   +1 more source

Molecular dynamics simulation of atomic layer etching for sidewall damage recovery in GaN-based structures

Scientific Reports
Today, as GaN-based devices are becoming increasingly smaller, dry etching has been employed, but it has caused damage, particularly in InGaN/GaN multiple quantum well (MQW) structures exposed to Cl2-based reactive ion etching (RIE).
Eun Koo Kim, Jong Woo Hong, Woong Sun Lim, Ja Yeon Kim, Kyung Lim Kim, Jong Soon Park, Yun Jae Park, Chan Ho Kim, Hyeong Joon Eoh, Jun Won Jeong, Sung Hyun Kim, Young Woo Jeon, Dong Woo Kim, Geun Young Yeom   +13 more
doaj   +1 more source

Ion‐Reconfigurable “N”‐Shaped Antiambipolar Behavior in Organic Electrochemical Transistors

Advanced Materials, EarlyView.
A unique N‐shaped negative differential transconductance (NDT) characteristics is demonstrated in single‐polymer organic electrochemical transistors through a sequential doping–redox–doping process driven by iodide ions. This redox‐driven mechanism enables low‐voltage, ion‐controlled reconfigurability and tunable current modulation, allowing seamless ...
Debdatta Panigrahi, Daniele Zucchelli, Zeinab Hamid, Christina Kousseff, Arup Sarkar, Aristea Pavlou, Zhitian Ling, Somayeh Kashani, Iain McCulloch, Paul W. M. Blom, Fabrizio Torricelli, Paschalis Gkoupidenis   +11 more
wiley   +1 more source

17.6% Conversion Efficiency Multicrystalline Silicon Solar Cells Using the Reactive Ion Etching with the Damage Removal Etching

International Journal of Photoenergy, 2012
For lower reflectance, we applied a maskless plasma texturing technique using reactive ion etching (RIE) on acidic-textured multicrystalline silicon (mc-Si) wafer. RIE texturing had a deep and narrow textured surface and showed excellent low reflectance.
Ji-Myung Shim, Hyun-Woo Lee, Kyeong-Yeon Cho, Jae-Keun Seo, Ji-Soo Kim, Eun-Joo Lee, Jun-Young Choi, Dong-Joon Oh, Jeong-Eun Shin, Ji-Sun Kim, Ji-Hyun Kong, Soo-Hong Lee, Hae-Seok Lee   +12 more
doaj   +1 more source

Three step deep reactive ion etch for high density trench etching

, 2016
A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10μm wide to a depth of 130μm into silicon with an etch rate of 2.5μm min-1. The aim of this process is to obtain sidewalls with an angle close to 90°. The process allows
Bram Lips, R. Puers
semanticscholar   +1 more source

Self‐Assembled Monolayers in p–i–n Perovskite Solar Cells: Molecular Design, Interfacial Engineering, and Machine Learning–Accelerated Material Discovery

Advanced Materials, EarlyView.
This review highlights the role of self‐assembled monolayers (SAMs) in perovskite solar cells, covering molecular engineering, multifunctional interface regulation, machine learning (ML) accelerated discovery, advanced device architectures, and pathways toward scalable fabrication and commercialization for high‐efficiency and stable single‐junction and
Asmat Ullah, Ying Luo, Stefaan De Wolf
wiley   +1 more source