Results 61 to 70 of about 8,725 (286)

Advances in Sustainable and Wearable Textile Based Soft Robotics

Advanced Functional Materials, EarlyView.
This Review examines advances in wearable textile‐based soft robotics, focusing on sustainable materials, integrated sensing, and scalable actuation. It discusses manufacturing and system integration across healthcare, assistive robotics, prosthetics, and human–machine interfaces, and highlights key challenges in circular design, including life‐cycle ...
Zahir Abbas, Marzia Dulal, Sophia K. Novoselov, Victoria K. Novoselov, Kostya S. Novoselov, Shaila Afroj, Nazmul Karim   +6 more
wiley   +1 more source

A Thorough Review of Emerging Technologies in Micro- and Nanochannel Fabrication: Limitations, Applications, and Comparison

Micromachines
In recent years, the field of micro- and nanochannel fabrication has seen significant advancements driven by the need for precision in biomedical, environmental, and industrial applications.
Koosha Karimi, Ali Fardoost, Nikhil Mhatre, Jay Rajan, David Boisvert, Mehdi Javanmard   +5 more
doaj   +1 more source

Three step deep reactive ion etch for high density trench etching

Journal of Physics: Conference Series, 2016
A three step Deep Reactive Ion Etch (DRIE) process is developed to etch trenches of 10μm wide to a depth of 130μm into silicon with an etch rate of 2.5μm min-1. The aim of this process is to obtain sidewalls with an angle close to 90°. The process allows the etching of multiple trenches with high aspect ratios that are closely placed together.
Lips, Bram, Puers, Bob
openaire   +1 more source

Hierarchical MXene‐Derived NTP/C Nanohybrids for Cryogenic Sodium‐Ion Batteries

Advanced Functional Materials, EarlyView.
A hierarchical MXene‐derived NaTi2(PO4)3/C nanohybrid enables efficient sodium‐ion storage down to −40°C by integrating fast ion–electron transport pathways with an ether‐based electrolyte. The system promotes dominant pseudocapacitive behavior and forms a robust inorganic‐rich SEI, collectively mitigating kinetic and interfacial limitations, thereby ...
M. Sai Bhargava Reddy, Mohammad Zaid, Sayan Das, Sooryadas Sudhakaran, Shampa Aich, Vilas G. Pol   +5 more
wiley   +1 more source

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Micromachines, 2018
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj   +1 more source

Thermally Pre‐Formed Reconfigurable Resistive Random‐Access Memory Crossbar Arrays: A Dual‐Mode Platform for Robust Physically Unclonable Functions and In‐Memory Computing

Advanced Functional Materials, EarlyView.
A reconfigurable RRAM platform utilizing thermally pre‐formed filaments (TPFs) is developed to realize robust hardware security. By exploiting the thermodynamic stochasticity of TPFs, exceptionally reliable physically unclonable functions (PUFs) are achieved.
Seongbin Kwon, Taewon Lee, Dohyeong Kim, Sungmin Hwang, Sungjoon Kim   +4 more
wiley   +1 more source

Impedance measurements for determination of elastic and piezoelectric coefficients of films [PDF]

, 2010
Most of those techniques used for the measurement of elastic coefficients for bulk piezoelectric ceramics are not applicable to films deposited on thick substrates because the measured properties, such as the resonant frequency, are usually dominated ...
Pardo, L., Brebøl, K., García, A., Leighton, Glenn J. T., Jiménez, R., Huang, Zhaorong   +5 more
core   +1 more source

Towards high-throughput large-area metalens fabrication using UV-nanoimprint lithography and Bosch deep reactive ion etching [PDF]

, 2020
We demonstrate the fabrication of diffraction-limited dielectric metasurface lenses for NIR by the use of standard industrial high-throughput silicon processing techniques: UV nano imprint lithography (UV-NIL) combined with continuous reactive ion ...
Angelskår, Hallvard, Gjessing, Jo, Jensen, Geir Uri, Thrane, Paul Conrad Vaagen, Dirdal, Christopher Andrew, Ordnung, Daniel Alfred   +5 more
core   +1 more source

Atomized Oxidative Polymerization as a 3D Printing Platform for Binder‐Free, Bulk Conductive Polymer Architectures

Advanced Functional Materials, EarlyView.
Co‐delivery of electrosprayed EDOT and oxidant enables bulk oxidative polymerization during layer‐by‐layer fabrication, creating stable, highly conductive 3D PEDOT structures. This Atomized Oxidative Polymerization (AOP) overcomes the surface deposition‐only and matrix‐limited conductivity of conventional Vapor Phase Polymerization (VPP) and PEDOT:PSS ...
Tazdik Patwary Plateau, Hiep Pham, Jonghyun Park   +2 more
wiley   +1 more source

Optimization of Etching Profile in Deep-Reactive-Ion Etching for MEMS Processes of Sensors

Journal of Sensor Science and Technology, 2015
This paper reports the results of a study on the optimization of the etching profile, which is an important factor in deep-reactive-ion etching (DRIE), i.e., dry etching. Dry etching is the key processing step necessary for the development of the Internet of Things (IoT) and various microelectromechanical sensors (MEMS). Large-area etching (open area >
Chung Mo Yang, Hee Yeoun Kim, Jae Hong Park   +2 more
openaire   +2 more sources