Results 71 to 80 of about 8,725 (286)

Coupling Anodic Activity and Stability at Ni‐Based Non‐Oxide Catalysts via Coordinating Alcohol Oxidation and Oxygen Evolution

Advanced Functional Materials, EarlyView.
A cooperative and competitive interrelationship between alcohol oxidation (AOR) and water oxidation (OER) was observed on a typical anode catalyst of Ni2P. In situ Raman spectroscopy and electrochemical analyses revealed a specific complementary mechanism between them, in which OER and AOR critically contribute to the activity and stability of anodic ...
Yong Yan, Xinyu Liu, Yuguo Zhao, Hanwen Jian, Huan Zhou, Riyi Zhang, Dong Wang, Peter Schaaf, Lihua Wang, Guangsheng Guo, Xiayan Wang   +10 more
wiley   +1 more source

Investigation of Deep Trench Process for Trench-gate IGBT

Kongzhi Yu Xinxi Jishu, 2013
Deep trench plasma etch process which is suitable for trench-gate IGBT has been developed based on Lam 4420 reactive ion etching (RIE) tool and Cl2. An undercut-free 6 μm-deep trench with round bottom corners and around 3°sidewall slope is obtained by ...
LUO Haihui, HUANG Jianwei, DEVINY Ian, LIU Guoyou   +3 more
doaj  

Design and Fabrication of Capacitive Silicon Nanomechanical Resonators with Selective Vibration of a High-Order Mode

Micromachines, 2017
This paper reports the design and fabrication of capacitive silicon nanomechanical resonators with the selective vibration of a high-order mode. Fixed-fixed beam capacitive silicon resonators have been successfully produced by the use of electron beam ...
Nguyen Van Toan, Tsuyoshi Shimazaki, Naoki Inomata, Yunheub Song, Takahito Ono   +4 more
doaj   +1 more source

Sustainable Electrochemical Synthesis of High‐Quality MXenes: Mechanistic Insights, Applications, Challenges, and Technological Prospects

Advanced Functional Materials, EarlyView.
Electrochemical etching provides an eco‐friendly alternative to hazardous HF methods for MXene production. This approach facilitates the selective isolation of the A‐layer from MAX phases with tunable surface terminations. Controlling voltage, electrolytes, temperature, and duration enables the optimal structural integrity. Nevertheless, existing scale
Jagdeep Singh, Madhusudhana M Devadiga, Santosh K. Tiwari, AS Dhaliwal, Gurpreet Singh Selopal   +4 more
wiley   +1 more source

Stepped-etching for preserving critical dimensions in through-wafer deep reactive ion etching of thick silicon

, 2009
This paper presents the experimental investigation of stepped deep reactive ion etching (DRIE) process in order to minimize critical-dimension (CD) variations due to local heating observed in through-wafer etch of 100 mum-thick, high aspect ratio silicon
Akın, Tayfun, Aydemir, A., S. E. Alper, T. Akin, Alper, Said Emre, A. Aydemir   +5 more
core   +1 more source

Neutrophil‐Mimetic MRI Enables Ultra‐Early Detection of Vascular Inflammation After Stroke

Advanced Healthcare Materials, EarlyView.
In this study, we developed neutrophil‐mimetic MRI probes that detect ultra‐early neuroinflammation following ischemic stroke by targeting E‐selectin. Within seconds of their injection, these microparticles mimic initial leukocyte adhesion to the activated cerebral endothelium.
Marion Isabelle Morvan, Damien Levard, Eloïse Lemarchand, Amal Boublay, Charly Helaine, Jolan Malherbe, Mikaël Naveau, Didier Goux, Igor Khalin, Ankita Talukdar, Cheun Pelleter, Charlène Jacqmarcq, Erwan Baudron, Isabelle Bardou, Sara Martinez de Lizarrondo, Maxime Gauberti, Denis Vivien, Antoine Philippe Fournier   +17 more
wiley   +1 more source

Enhanced near-infrared absorber: two-step fabricated structured black silicon and its device application

Nanoscale Research Letters, 2018
Silicon is widely used in semiconductor industry but has poor performance in near-infrared photoelectronic devices because of its high reflectance and band gap limit.
Hao Zhong, Nasir Ilyas, Yuhao Song, Wei Li, Yadong Jiang   +4 more
doaj   +1 more source

Deep Levels Induced by SiCI₄ Reactive Ion Etching in GaAs

, 1993
Deep Level Transient Spectroscopy (DLTS) is used to investigate the effect of SiC14 Reactive Ion Etching (RIE) on GaAs. At high power (150-80 W) with high DC self bias (380-240 V), five deep levels trapping electrons are observed at energies of 0.30, 0 ...
M. A. Foad, N.P. Johnson, S. Murad, C. D. W. Wilkinson, M. C. Holland   +4 more
core   +1 more source

Atomic Layer Deposition Processes: Versatile Platforms for Engineering ZnO‐Chitosan Biointerfaces

Advanced Healthcare Materials, EarlyView.
Vapour phase metalation (VPM), multiplied pulsed vapour phase infiltration (MPI), and O2 plasma‑enhanced atomic layer deposition (PEALD) tailor Zn–chitosan (Zn‑CS) films. PEALD improves wettability and biocompatibility. MPI enhances semiconductor behavior. Antiseptic selectivity: VPM → E. coli; MPI → H. pylori.
Mabel Moreno, Anjana Devi, David Zanders, Miryam Arredondo, Davide Mariotti, Ruairi McGlynn, Sindy Devis, Simón Guerrero, Eglantina Benavente, Matias Alegría, Yusser Olguin, Lorena Lobos‐Gonzalez, Kevin Guzmán, Elizabeth Rivas‐Yañez, Paula Solar, Valentin Cepus, Michael Krause, Luis Velásquez   +17 more
wiley   +1 more source

Fabrication and electrochemical characterization of ruthenium nanoelectrodes

Current Directions in Biomedical Engineering, 2017
The Fraunhofer IMS has recently developed a technique for producing nanoelectrodes that are generated by atomic layer deposition (ALD) in a via deep reactive ion etching (DRIE) structured sacrificial layer.
Allani Sonja, Jupe Andreas, Figge Martin, Goehlich Andreas, Vogt Holger   +4 more
doaj   +1 more source