Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching [PDF]
The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M Baracu +2 more
exaly +6 more sources
Cryogenic Etching of High Aspect Ratio 400-nm Pitch Silicon Gratings [PDF]
The cryogenic process and Bosch process are two widely used processes for reactive ion etching of high aspect ratio silicon structures. This paper focuses on the cryogenic deep etching of 400 nm pitch silicon gratings with various etching mask materials including polymer, Cr, SiO2 and Cr-on-polymer.
Houxun Miao, Han Wen
exaly +5 more sources
Study of Cryogenic Unmasked Etching of “Black Silicon” with Ar Gas Additives [PDF]
The influence of Ar gas additives on ≪black silicon≫ formation is shown in this work. The way to achieve the conical shape of Si texture using low Ar dilution is demonstrated. Also, a possibility of silicon nanowire width reduction keeping a high density of array is shown. No damage to the Si structure caused by Ar plasma was detected. The introduction
Ekaterina A. Vyacheslavova +7 more
doaj +3 more sources
In Situ Growth, Etching, and Charging of Nanoscale Water Ice Under Fast Electron Irradiation in Environmental TEM [PDF]
Understanding the formation, structural evolution, and response of water ice at the nanoscale is essential for advancing research in fields such as cryo-electron microscopy and atmospheric science.
Hongchen Chu +6 more
doaj +2 more sources
Cryogenic Electron Beam Induced Chemical Etching [PDF]
Cryogenic cooling is used to enable efficient, gas-mediated electron beam induced etching (EBIE) in cases where the etch rate is negligible at room and elevated substrate temperatures. The process is demonstrated using nitrogen trifluoride (NF3) as the etch precursor, and Si, SiO2, SiC, and Si3N4 as the materials volatilized by an electron beam ...
Aiden A Martin, Milos Toth
exaly +3 more sources
Cryogenic plasma deep-etching for silicon sub-micron structures was studied with the use of modified poly(styrene) (PS) perforated masks obtained from laterally phase separated PS and poly (lactic acid) PLA blend thin films.
Rémi Dussart
exaly +3 more sources
Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics [PDF]
Gallium-based liquid metals (LMs) are promising materials for stretchable electronics due to their metallic conductivity and deformability. However, the fabrication of large-area stretchable integrated electronics using LMs on various polymers remains ...
Do Hoon Lee +19 more
doaj +2 more sources
Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures [PDF]
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employing SF/sub 6//O/sub 2/-based high-density plasmas at cryogenic temperatures.
Mj De Boer +2 more
exaly +4 more sources
Optimization of Soft X-Ray Fresnel Zone Plate Fabrication Through Joint Electron Beam Lithography and Cryo-Etching Techniques [PDF]
The ability to manufacture complex 3D structures with nanometer-scale resolution, such as Fresnel Zone Plates (FZPs), is crucial to achieve state-of-the-art control in X-ray sources for use in a diverse range of cutting-edge applications.
Maha Labani +5 more
doaj +2 more sources
Quantum circuits with SINIS structures [PDF]
The superconductor–insulator–normal metal–insulator–superconductor (SINIS) tunnel junction structure is the basic building block for various cryogenic devices. Microwave detectors, electron coolers, primary thermometers, and Aharonov–Bohm interferometers
Mikhail Tarasov +13 more
doaj +2 more sources

