Results 1 to 10 of about 374 (68)

Development and Recent Progress on Ammonia Synthesis Catalysts for Haber–Bosch Process

Advanced Energy & Sustainability Research, 2021
Due to its essential use as a fertilizer, ammonia synthesis from nitrogen and hydrogen is considered to be one of the most important chemical processes of the last 100 years.
John Humphreys, Rong Lan, Shanwen Tao
doaj   +2 more sources

Fabrication of Needle-Like Silicon Nanowires by Using a Nanoparticles-Assisted Bosch Process for Both High Hydrophobicity and Anti-Reflection

Micromachines, 2021
In this work, a modified Bosch etching process is developed to create silicon nanowires. Au nanoparticles (NPs) formed by magnetron sputtering film deposition and thermal annealing were employed as the hard mask to achieve controllable density and high ...
Zengxing Zhang, Guohua Liu, Kaiying Wang
doaj   +3 more sources

Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes

Micromachines, 2023
Micro-optical gyroscopes (MOGs) place a range of components of the fiber-optic gyroscope (FOG) onto a silicon substrate, enabling miniaturization, low cost, and batch processing.
Yuyu Zhang, Yu Wu, Quanquan Sun, Lifeng Shen, Jie Lan, Lingxi Guo, Zhenfeng Shen, Xuefang Wang, Junfeng Xiao, Jianfeng Xu   +9 more
doaj   +1 more source

Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching

Micromachines, 2021
The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu, Christopher A. Dirdal, Andrei M. Avram, Adrian Dinescu, Raluca Muller, Geir Uri Jensen, Paul Conrad Vaagen Thrane, Hallvard Angelskår   +7 more
doaj   +1 more source

UV Hyperspectral Imaging as Process Analytical Tool for the Characterization of Oxide Layers and Copper States on Direct Bonded Copper

Sensors, 2021
Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance
Mohammad Al Ktash, Mona Stefanakis, Tim Englert, Maryam S. L. Drechsel, Jan Stiedl, Simon Green, Timo Jacob, Barbara Boldrini, Edwin Ostertag, Karsten Rebner, Marc Brecht   +10 more
doaj   +1 more source

A Resolved Simulation Approach to Investigate the Separation Behavior in Solid Bowl Centrifuges Using Material Functions

Separations, 2022
The separation of finely dispersed particles from liquids is a basic operation in mechanical process engineering. On an industrial scale, continuously operating decanter centrifuges are often used, whose separation principle is based on the density ...
Helene Katharina Baust, Simon Hammerich, Hartmut König, Hermann Nirschl, Marco Gleiß   +4 more
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Exploring how design guidelines benefit design engineers: an international and global perspective

Design Science, 2020
A multitude of design guidelines that are intended to support design engineers with knowledge and information during the embodiment design of physical products have been developed back in the 1980s and 1990s.
Benedikt Reimlinger, Quentin Lohmeyer, Ralf Moryson, Mirko Meboldt   +3 more
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UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

Nanomaterials, 2023
As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning.
Christopher A. Dirdal, Karolina Milenko, Anand Summanwar, Firehun T. Dullo, Paul C. V. Thrane, Oana Rasoga, Andrei M. Avram, Adrian Dinescu, Angela M. Baracu   +8 more
doaj   +1 more source

Comparison between Bosch and STiGer Processes for Deep Silicon Etching

Micromachines, 2021
The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented.
Thomas Tillocher, Jack Nos, Gaëlle Antoun, Philippe Lefaucheux, Mohamed Boufnichel, Rémi Dussart   +5 more
doaj   +1 more source

Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD

Micromachines, 2022
In micro-machined micro-electromechanical systems (MEMS), refilled high-aspect-ratio trench structures are used for different applications. However, these trenches often show keyholes, which have an impact on the performance of the devices. In this paper,
Henk-Willem Veltkamp, Yves L. Janssens, Meint J. de Boer, Yiyuan Zhao, Remco J. Wiegerink, Niels R. Tas, Joost C. Lötters   +6 more
doaj   +1 more source