Results 41 to 50 of about 2,906 (237)

Terahertz nanospectroscopy of plasmon polaritons for the evaluation of doping in quantum devices

Nanophotonics, 2023
Terahertz (THz) waves are a highly sensitive probe of free carrier concentrations in semiconducting materials. However, most experiments operate in the far-field, which precludes the observation of nanoscale features that affect the material response ...
Guo Xiao, He Xin, Degnan Zachary, Chiu Chun-Ching, Donose Bogdan C., Bertling Karl, Fedorov Arkady, Rakić Aleksandar D., Jacobson Peter   +8 more
doaj   +1 more source

Arrays of Sub-Terahertz Cryogenic Metamaterial

Applied Sciences, 2021
Integrated quasi-optical cryogenic terahertz receivers contain arrays of detectors, quasi-optical filters, interferometers, and other metamaterials. Matrices of quasi-optical band-pass, low-pass, and high-pass filters, Fabry–Perot grid interferometers ...
Mikhail Tarasov, Aleksandra Gunbina, Artem Chekushkin, Vyacheslav Vdovin, Aleksei Kalaboukhov   +4 more
doaj   +1 more source

Cryogenic nanoscale etching of silicon nitride selectively to silicon by alternating SiF 4 /O 2 and Ar plasmas

, 2022
International audienceThis article first presents quasi- in situ XPS measurements on Si 3 N 4 and a-Si samples after exposure to an SiF 4 /O 2 plasma at different cryogenic temperatures.
Cardinaud, Christophe, H. Kim, C. Cardinaud, P. Lefaucheux, Antoun, Gaelle, M. Wang, K. Maekawa, Wang, M., Zhang, D., T. Tillocher, Lefaucheux, Philippe, A. Girard, J. Faguet, Tillocher, Thomas, Faguet, J., D. Zhang, Dussart, Rémi, Maekawa, K., Kim, H., G. Antoun, R. Dussart, Girard, Aurélie   +21 more
core   +1 more source

Microfabrication of large-area circular high-stress silicon nitride membranes for optomechanical applications

AIP Advances, 2016
In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiNx membranes using Deep Reactive Ion Etching (DRIE).
E. Serra, M. Bawaj, A. Borrielli, G. Di Giuseppe, S. Forte, N. Kralj, N. Malossi, L. Marconi, F. Marin, F. Marino, B. Morana, R. Natali, G. Pandraud, A. Pontin, G. A. Prodi, M. Rossi, P. M. Sarro, D. Vitali, M. Bonaldi   +18 more
doaj   +1 more source

Microstructure Evolution of a VMnFeCoNi High‐Entropy Alloy After Synthesis, Swaging, and Annealing

Advanced Engineering Materials, EarlyView.
The synthesis and processing (rotary swaging and annealing) of the novel VMnFeCoNi alloy is investigated, alongside the estimation of the grain size effect on hardness. Analysis of a wide grain size range of recrystallized microstructures (12–210 µm) reveals a low annealing twin density.
Aditya Srinivasan Tirunilai, Zeki Ayrildi, Buse Şen, Maik Rajkowski, Mathias Redondo Garcia, Markus Stricker, Guillaume Laplanche   +6 more
wiley   +1 more source

Investigation of microstructural attributes of steel surfaces through magneto-optical Kerr effect

Journal of Materials Research and Technology, 2021
Magneto-optical Kerr effect (MOKE) microscopy is a versatile technique to image magnetic domains and evaluate the behavior of magnetic materials. However, MOKE has been rarely applied to the research of low magnetic steels with complex microstructure ...
M. Jovičević-Klug, P. Jovičević-Klug, J. McCord, B. Podgornik   +3 more
doaj   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source

Role of CF₄ Addition in Gas-Phase Variations in HF Plasma for Cryogenic Etching: Insights from Plasma Simulation and Experimental Correlation

Plasma
The fabrication of semiconductor devices with three-dimensional architectures imposes unprecedented demands on advanced plasma dry etching processes. These include the simultaneous requirements of high throughput, high material selectivity, and precise ...
Shigeyuki Takagi, Shih-Nan Hsiao, Yusuke Imai, Makoto Sekine, Fumihiko Matsunaga   +4 more
doaj   +1 more source

Black silicon morphologies using conventional RIE processing

AIP Advances, 2017
We report on the use of conventional non-Bosch, non-cryogenic Reactive Ion Etching (RIE) processing to produce a range of low optical reflection morphologies on silicon wafer. Tapered structures and nano dendritic-pillars are patterned into silicon over
Zahidur R. Chowdhury, Joel Y. Y. Loh, Md. Nishanto Nahid Pishon, Nazir P. Kherani   +3 more
doaj   +1 more source

Cross-effect of surface finishing and deep cryogenic treatment on corrosion resistance of AISI M35 steel

Journal of Materials Research and Technology, 2021
The improvement of corrosion lifetime of commonly used steels is an important characteristic that is required for development of steel products for usage in non-traditional corrosion environments and specialized applications such as oil and gas industry.
Matic Jovičević-Klug, Patricia Jovičević-Klug, Tjaša Kranjec, Bojan Podgornik   +3 more
doaj   +1 more source