Results 51 to 60 of about 6,900 (149)

Fabrication of a fractal pattern device for focus characterizations of X-ray imaging systems by Si deep reactive ion etching and bottom-up Au electroplating. [PDF]

Appl Opt, 2022
Shi Z, Josell D, Jefimovs K, Romano L, Moffat TP, Stampanoni M, Schlepütz CM.   +6 more
europepmc   +1 more source

Die Separation Strength for Deep Reactive Ion Etched Wafers

, 2011
Typical micro-scale devices made via cleanroom processes are often produced in bulk quantities on a single wafer. Depending on the lateral dimensions of a device, as many as a few hundred can be manufactured on an individual wafer. With expensive required facilities and raw materials, industrial manufacturing of siliconbased electrical and MEMS devices
D. A. Porter, T. A. Berfield
openaire   +3 more sources

DESIGN AND FABRICATION OF MICRONOZZLES

International Islamic University Malaysia Engineering Journal, 2011
Micronozzle, a key component in micropropulsion system, has been designed and fabricated. Quasi 1D inviscid theory was used in designing a series of conical micronozzles of different expander half-angles (10°-50°).
Kean How Cheah, Jit Kai Chin
doaj   +1 more source

Silicon Deep Reactive Ion Etching with aluminum hard mask

Materials Research Express, 2019
Silicon Deep Reactive Ion Etching (DRIE) process using a multi-layer mask containing a sputtered Aluminum thin film is studied. Aluminum is a candidate for very high aspect ratio DRIE, due to tis very low etch rate, but its adoption is hindered by the presence of micromasking.
Bagolini, A, Scauso, P, Sanguinetti, S, Bellutti, P   +3 more
openaire   +3 more sources

MEMS Inertial Switch for Military Applications

Proceedings, 2017
We developed a MEMS inertial switch (hereafter, the switch) for an ignition system of missiles. The developed switch consists of four folded beams and a plate suspended by the beams, analogous to a well-known spring-mass system.
Hyo-Nam Lee, Seung-Gyo Jang, Sungryeol Lee, Jeong-Sun Lee, Young-Suk Hwang   +4 more
doaj   +1 more source

A Review of Non-Laser and Laser Machining for Through-Glass via Fabrication

Micromachines
As semiconductor packaging technology evolves from two-dimensional to three-dimensional integration, the through-glass via (TGV) technique, as a core interconnect method in advanced packaging, is emerging as a strong candidate to replace through-silicon ...
Yong Zhang, Keke Zhang, Yapeng Xu, Wenjun Tong, Junfeng Wang, Wuyi Ming   +5 more
doaj   +1 more source

Correction to Ultrahigh Resolution Titanium Deep Reactive Ion Etching [PDF]

ACS Applied Materials & Interfaces, 2017
Bryan W K, Woo, Shannon C, Gott, Ryan A, Peck, Dong, Yan, Mathias W, Rommelfanger, Masaru P, Rao   +5 more
openaire   +2 more sources

Fabrication of Ultra‐Thick Masks for X‐Ray Phase Contrast Imaging at Higher Energy

Advanced Materials Interfaces
X‐ray phase contrast imaging (XPCI) provides higher sensitivity to contrast between low absorbing objects that can be invisible to conventional attenuation‐based X‐ray imaging.
Alessandro Rossi, Ian Buchanan, Alberto Astolfo, Martyna Michalska, Daniel Briglin, Anton Charman, Daniel Josell, Alessandro Olivo, Ioannis Papakonstantinou   +8 more
doaj   +1 more source

Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications

Advanced Electronic Materials
Integrating piezoelectric materials onto the vertical surfaces of microelectromechanical systems (MEMS) microstructures enables three‐dimensional piezoelectric (3D piezoMEMS) devices, providing multi‐axis sensing and actuation capabilities with a reduced
Arsam Ali, Glenn Ross, Mervi Paulasto‐Kröckel   +2 more
doaj   +1 more source

Fabrication of sharp silicon hollow microneedles by deep-reactive ion etching towards minimally invasive diagnostics. [PDF]

Microsyst Nanoeng, 2019
Li Y, Zhang H, Yang R, Laffitte Y, Schmill U, Hu W, Kaddoura M, Blondeel EJM, Cui B.   +8 more
europepmc   +1 more source