Results 21 to 30 of about 8,725 (286)
The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
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Two-step Fabrication of Large Area SiO2/Si Membranes
Medžiagotyra, 2012 Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS +7 more
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APL Materials, 2022 Incorporating ultrahigh concentrations of deep-level dopants in silicon drastically alters silicon’s optoelectronic properties. Photodiodes built from silicon hyperdoped with gold extend light sensitivity into the shortwave infrared region, far beyond ...
Sashini Senali Dissanayake +10 more
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Nanomaterials, 2022 Micromachined devices were developed and fabricated using complementary metal-oxide-semiconductor (CMOS)/micro-electro-mechanical systems (MEMS) technology allowing for the analysis of transport properties of silicon sub-micron beams having monolithic ...
Andrej Stranz +2 more
doaj +1 more source
Micromachines, 2018 A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution.
Jia-Cheng Yu +6 more
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Etching technique of high aspect ratio silicon trenches based on CMOS-MEMS process
Dianzi Jishu Yingyong, 2018 Etching technique of deep silicon trenches with high aspect ratio is critical in improving integration and accuracy of Micro-Electro-Mechanical Systems(MEMS)sensor array and reducing the cost of it.
Zhang Haihua, Lv Yufei, Lu Zhongxuan
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Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio
Micro and Nano Systems Letters, 2022 During deep reactive ion etching (DRIE), microscale etch masks with small opening such as trenches or holes suffer from limited aspect ratio because diffusion of reactive ions and free radicals become progressively difficult as the number of DRIE cycle ...
Taeyeong Kim, Jungchul Lee
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Cryogenic deep reactive ion etching of silicon micro and nanostructures [PDF]
, 2009 This thesis focuses on cryogenic deep reactive ion etching (DRIE) and presents how it can be applied to the fabrication of silicon micro- and nanostructures that have applications in microfluidics and micromechanics.
Sainiemi, Lauri
core +1 more source
Deep Reactive-Ion Etching Development With the Bosch Process [PDF]
, 2022 The Bosch process is a type of deep reactive-ion etching (DRIE) of silicon. It is a type of plasma etching, or dry etching, that uses physical and chemical processes to etch the surface of a silicon sample.
Pier, Marcelo
core
Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon
Proceedings, 2017 This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba +4 more
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