Results 11 to 20 of about 19,615 (204)
Development of Micron Sized Photonic Devices Based on Deep GaN Etching
Photonics, 2021 In order to design and development efficient III-nitride based optoelectronic devices, technological processes require a major effort. We propose here a detailed review focussing on the etching procedure as a key step for enabling high date rate ...
Karim Dogheche +3 more
doaj +1 more source
Redeposition-Free Deep Etching in Small KY(WO4)2 Samples
Micromachines, 2020 KY(WO4)2 is a promising material for on-chip laser sources. Deep etching of small KY(WO4)2 samples in combination with various thin film deposition techniques is desirable for the manufacturing of such devices.
Simen Mikalsen Martinussen +3 more
doaj +1 more source
Micro and Nano Systems Letters, 2020 Deep reactive-ion etching (DRIE) is commonly used for high aspect ratio silicon micromachining. However, scalloping, which is the result of the alternating Bosch process of DRIE, can cause many problems in the subsequent process and degrade device ...
Jin Soo Park +7 more
doaj +1 more source
Etch mechanism of an Al2O3 hard mask in the Bosch process
Micro and Nano Engineering, 2022 The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost +7 more
doaj +1 more source
The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
doaj +1 more source
Microsystems & Nanoengineering, 2019 Microneedle technologies have the potential for expanding the capabilities of wearable health monitoring from physiology to biochemistry. This paper presents the fabrication of silicon hollow microneedles by a deep-reactive ion etching (DRIE) process ...
Yan Li +8 more
semanticscholar +1 more source
Two-step Fabrication of Large Area SiO2/Si Membranes
Medžiagotyra, 2012 Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS +7 more
doaj +1 more source
APL Materials, 2022 Incorporating ultrahigh concentrations of deep-level dopants in silicon drastically alters silicon’s optoelectronic properties. Photodiodes built from silicon hyperdoped with gold extend light sensitivity into the shortwave infrared region, far beyond ...
Sashini Senali Dissanayake +10 more
doaj +1 more source
Nanomaterials, 2022 Micromachined devices were developed and fabricated using complementary metal-oxide-semiconductor (CMOS)/micro-electro-mechanical systems (MEMS) technology allowing for the analysis of transport properties of silicon sub-micron beams having monolithic ...
Andrej Stranz +2 more
doaj +1 more source
, 2020 We fabricated two-dimensional arrays of periodic, widely-spaced pillars using deep reactive ion etching of silicon. To avoid the formation of micro-grass in the large open areas we used sacrificial structures surrounding the widely-spaced pillars.
C. Silvestre +3 more
semanticscholar +1 more source