Results 11 to 20 of about 6,900 (149)
Development of Micron Sized Photonic Devices Based on Deep GaN Etching
Photonics, 2021 In order to design and development efficient III-nitride based optoelectronic devices, technological processes require a major effort. We propose here a detailed review focussing on the etching procedure as a key step for enabling high date rate ...
Karim Dogheche +3 more
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Redeposition-Free Deep Etching in Small KY(WO4)2 Samples
Micromachines, 2020 KY(WO4)2 is a promising material for on-chip laser sources. Deep etching of small KY(WO4)2 samples in combination with various thin film deposition techniques is desirable for the manufacturing of such devices.
Simen Mikalsen Martinussen +3 more
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Micro and Nano Systems Letters, 2020 Deep reactive-ion etching (DRIE) is commonly used for high aspect ratio silicon micromachining. However, scalloping, which is the result of the alternating Bosch process of DRIE, can cause many problems in the subsequent process and degrade device ...
Jin Soo Park +7 more
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Etch mechanism of an Al2O3 hard mask in the Bosch process
Micro and Nano Engineering, 2022 The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost +7 more
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Deep reactive ion etching of silicon carbide [PDF]
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2001 In this article, we describe more than 100-μm-deep reactive ion etching (RIE) of silicon carbide (SiC) in oxygen-added sulfur hexafluoride (SF6) plasma. We used a homemade magnetically enhanced, inductively coupled plasma reactive ion etcher (ME-ICP-RIE) and electroplated nickel masks. First, 5 h etching experiments using etching gases with 0%, 5%, 10%
Tanaka, S, Rajanna, K, Abe, T, Esashi, M
openaire +2 more sources
The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
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APL Materials, 2022 Incorporating ultrahigh concentrations of deep-level dopants in silicon drastically alters silicon’s optoelectronic properties. Photodiodes built from silicon hyperdoped with gold extend light sensitivity into the shortwave infrared region, far beyond ...
Sashini Senali Dissanayake +10 more
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Two-step Fabrication of Large Area SiO2/Si Membranes
Medžiagotyra, 2012 Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS +7 more
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Nanomaterials, 2022 Micromachined devices were developed and fabricated using complementary metal-oxide-semiconductor (CMOS)/micro-electro-mechanical systems (MEMS) technology allowing for the analysis of transport properties of silicon sub-micron beams having monolithic ...
Andrej Stranz +2 more
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Deep reactive ion etching of cylindrical nanopores in silicon for photonic crystals
Nanotechnology, 2022 Abstract Periodic arrays of deep nanopores etched in silicon by deep reactive ion etching are desirable structures for photonic crystals and other nanostructures for silicon nanophotonics. Previous studies focused on realizing as deep as possible nanopores with as high as possible aspect ratios.
Melissa J Goodwin +3 more
openaire +3 more sources