Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes. [PDF]
Lee H.
europepmc +1 more source
Wet-Oxidation-Assisted Chemical Mechanical Polishing and High-Temperature Thermal Annealing for Low-Loss 4H-SiC Integrated Photonic Devices. [PDF]
Shi X +4 more
europepmc +1 more source
A magnetically controlled chemical-mechanical polishing (MC-CMP) approach for fabricating channel-cut silicon crystal optics for the High Energy Photon Source. [PDF]
Hong Z +15 more
europepmc +1 more source
Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon. [PDF]
Xia J +5 more
europepmc +1 more source
Research on the Application of Diamond Film in Chemical Mechanical Polishing. [PDF]
Wang Y +10 more
europepmc +1 more source
Photo-oxidative degradation of polyacids derived ceria nanoparticle modulation for chemical mechanical polishing. [PDF]
Kim E, Hong J, Seok H, Kim T.
europepmc +1 more source
Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing. [PDF]
Geng W +8 more
europepmc +1 more source
Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding. [PDF]
Kang S +5 more
europepmc +1 more source
A Comprehensive Review of the Nano-Abrasives Key Parameters Influencing the Performance in Chemical Mechanical Polishing. [PDF]
Bellahsene H +5 more
europepmc +1 more source
Controllable Synthesis of Monodisperse CeO<sub>2</sub> Nanoparticles with Tunable Sizes for Chemical-Mechanical Polishing. [PDF]
Ma Y +6 more
europepmc +1 more source

