Results 141 to 150 of about 1,057 (152)

Chemical Mechanical Polishing (CMP) of Fused Silica (FS) Using Ceria Slurry Recycling

ECS Journal of Solid State Science and Technology, 2020
Yan Zhou, Haimei Luo, Guihai Luo, Gaopan Chen, Chengxi Kang, Guoshun Pan   +5 more
openaire   +1 more source

The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)

ECS Journal of Solid State Science and Technology, 2017
Chengwu Wang, Syuhei Kurokawa, Toshiro Doi, Julong Yuan, Yasuhisa Sano, Hideo Aida, Kehua Zhang, Qianfa Deng   +7 more
openaire   +1 more source

WITHDRAWN: Chemical coagulation/floculation treatment of chemical mechanical polishing (CMP) wastewater from photovoltaic industry

Journal of Hazardous Materials, 2008
M. Bouiri, M. Hachemi, A. Maallemi
openaire   +1 more source

Chemical-mechanical polishing (CMP) process of STI and DTI- Ching-Yu Hsieh

2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM), 2019
Shih-Ping Lee, Tzu-Hsuan Tseng, Chih-Hao Chuang, Chien-Ying Chuang, Cheng-Hung Cheng, Hsin-Ying Tung, Pin-Chieh Huang, Chung-Tien Chou   +7 more
openaire   +1 more source

Experimental investigation of chemical mechanical polishing (CMP) process parameters through polishing of optical glass

AIP Conference Proceedings
Aparajita Parashar, Manoj Kumar, Raj Kumar Pal, Vinod Karar   +3 more
openaire   +1 more source

Chemical Mechanical Polishing (CMP) of SiC Wafer Using Photo-Catalyst Incorporated Pad

ECS Journal of Solid State Science and Technology, 2017
Yan Zhou, Guoshun Pan, Chunli Zou, Lei Wang   +3 more
openaire   +1 more source

Novel electrolysis-ionized-water cleaning technique for the chemical-mechanical polishing (CMP) process

, 2002
Hidemitsu Aoki, Tasuku Nakajima, K. Kikuta, Y. Hayashi   +3 more
openalex   +1 more source

A Novel Strategy for the Synthesis of CeO2/CeF3 Composite Powders with Improved Suspension Stability and Chemical Mechanical Polishing (CMP) Performance

, 2015
Zongtao Zhang, Gongdong Yu, Ying Zhou, Lin Dong, Qiuxia Sun, Jia Xiaolin, Guosheng Shao   +6 more
openalex   +1 more source

Finite Element Analysis (FEA) of Pad Deformation Due to Diamond Disc Conditioning in Chemical Mechanical Polishing (CMP)

, 2011
Emmanuel A. Baisie, Bin Lin, Xiaohong Zhang, Zhichao Li   +3 more
openalex   +1 more source

Characterization of Slurries Used for Chemical‐Mechanical Polishing (CMP) in the Semiconductor Industry

, 2003
T. Kuntzsch, U. Witnik, M. Hollatz, Michael Stintz, S. Ripperger   +4 more
openalex   +1 more source