Results 1 to 10 of about 2,629 (140)

On the integration of ultrananocrystalline diamond (UNCD) with CMOS chip

open access: yesAIP Advances, 2017
A low temperature deposition of high quality ultrananocrystalline diamond (UNCD) film onto a finished Si-based CMOS chip was performed to investigate the compatibility of the UNCD deposition process with CMOS devices for monolithic integration of MEMS on
Hongyi Mi   +8 more
doaj   +1 more source

Phase Noise Reduction in a VHF MEMS-CMOS Oscillator Using Phononic Crystals

open access: yesIEEE Journal of the Electron Devices Society, 2016
This paper presents experimental results showing reduced phase noise in a very high frequency band microelectromechanical systems (MEMS) oscillator. This has been achieved by engineering the embedded MEMS resonator with phononic crystal structures.
Pei Qin   +3 more
doaj   +1 more source

A CMOS-MEMS lateral-axis gyroscope [PDF]

open access: yesTechnical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090), 2002
This paper reports on the experimental results from the first design of a CMOS lateral-axis vibratory gyroscope that utilizes comb fingers for both actuation and sensing. The fabrication is compatible with standard CMOS processes and the design has an integrated, fully-differential capacitive interface circuit.
Huikai Xie, Fedder, Gary K.
openaire   +1 more source

Low-Cost Microbolometer Type Infrared Detectors

open access: yesMicromachines, 2020
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications.
Le Yu   +5 more
doaj   +1 more source

Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor

open access: yesFrontiers in Mechanical Engineering, 2022
Environmental sensing units such as gas sensors, humidity sensors, pressure sensors, PM 2.5 sensors, or temperature sensors are widely used in our daily lives. In this study, CMOS-MEMS technology is exploited to fabricate and monolithically integrate the
Ya-Chu Lee   +5 more
doaj   +1 more source

A capacitive CMOS–MEMS sensor designed by multi-physics simulation for integrated CMOS–MEMS technology

open access: yesJapanese Journal of Applied Physics, 2014
This paper reports the design and evaluation results of a capacitive CMOS–MEMS sensor that consists of the proposed sensor circuit and a capacitive MEMS device implemented on the circuit. To design a capacitive CMOS–MEMS sensor, a multi-physics simulation of the electromechanical behavior of both the MEMS structure and the sensing LSI was carried out ...
Toshifumi Konishi   +5 more
openaire   +2 more sources

Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures

open access: yesIEEE Journal of the Electron Devices Society, 2017
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo   +5 more
doaj   +1 more source

Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone

open access: yesScientific Reports, 2022
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper   +4 more
doaj   +1 more source

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

open access: yesProceedings, 2017
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng   +6 more
doaj   +1 more source

Etching technique of high aspect ratio silicon trenches based on CMOS-MEMS process

open access: yesDianzi Jishu Yingyong, 2018
Etching technique of deep silicon trenches with high aspect ratio is critical in improving integration and accuracy of Micro-Electro-Mechanical Systems(MEMS)sensor array and reducing the cost of it.
Zhang Haihua, Lv Yufei, Lu Zhongxuan
doaj   +1 more source

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