Results 41 to 50 of about 392,135 (196)
Capacitive Sensors and Actuators by CMOS MEMS Foundry
This article introduces the current status of the 0.18-micron CMOS MEMS foundry service platform provided by the Taiwan Semiconductor Research Institute (TSRI), extensively covering the CMOS MEMS components that it has supported in development and ...
Lung-Jieh Yang +5 more
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We investigated a special electrical phenomenon, known as antisymmetric magnetoresistance with four distinct resistance states, in 2D Fe3GaTe2/Pt devices at room temperature. By designing devices with two separated magnetic nanoflakes, we confirmed that the effect originates from spin–momentum locking rather than magnetic domain walls or interface ...
Yunwen Zhu +10 more
wiley +1 more source
Liquid metal catalysts are widely assumed to promote high‐quality 2D growth. In this work, operando experiments and machine‐learning‐accelerated simulations show that hBN on Cu breaks this graphene‐derived expectation, where molten Cu promotes multilayer/3D growth, but re‐solidified single‐crystal Cu stabilizes monolayer formation.
Nikoo Ghanadan +17 more
wiley +1 more source
Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo +5 more
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Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper +4 more
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From Devices to Systems: Integration Strategies for Micro‐Supercapacitors in Microsystems
Micro‐supercapacitors are evolving from device‐level energy storage toward system‐level functional units in integrated microsystems. This Review presents a system‐oriented design framework in which integration serves as the key link between application requirements, system constraints, device architectures, and material selection. Monolithic and hybrid
Zhuohao Liu, Gang Li, Kaiying Wang
wiley +1 more source
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng +6 more
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The Gαi1/3 protein is a crucial connecting protein closely related to the signal transduction process of bone formation‐related cytokines such as BMP2. Gαi1/3 mediates downstream signaling pathways such as Smads and MAPK by binding to adaptor proteins like Gab1, thereby promoting the osteogenic effect of BMSCs.
Huajian Shan +10 more
wiley +1 more source
A Surface Micromachined CMOS MEMS Humidity Sensor [PDF]
This paper reports a CMOS MEMS (complementary metal oxide semiconductor micro electromechanical system) piezoresistive humidity sensor fabricated by a surface micromachining process. Both pre-CMOS and post-CMOS technologies were used to fabricate the piezoresistive humidity sensor.
Jian-Qiu Huang +3 more
openaire +2 more sources
Neuromorphic Devices and Computing for Sensing, Memory, and Control
This review introduces neuromorphic devices made from diverse materials. These devices mimic neuronal functions and architectures and, when integrated with artificial or biological computing, can form closed loops with neurons for pressure, optical, acoustic, and biochemical sensing and modulation.
Zhengguang Zhu +2 more
wiley +1 more source

