Results 31 to 40 of about 227,472 (115)

Advanced Manufacturing of Composite‐Based Systems for Energy Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Advanced manufacturing enables the integration of polymers, ceramics, metal oxides, and composites into architected microstructures with tailored transport pathways. By coupling material selection, manufacturing strategy, and structural design, multifunctional energy systems can simultaneously improve electrochemical performance, thermal management ...
Sri Vaishnavi Thummalapalli   +13 more
wiley   +1 more source

A Review of silicon carbide development in MEMS applications [PDF]

open access: yes, 2009
Due to its desirable material properties, Silicon Carbide (SiC) hasbecome an alternative material to replace Si for MicroelectromechanicalSystems (MEMS) applications in harsh environments.
Cheung, R.   +3 more
core   +2 more sources

Recent Advances in Transparent Microelectrode Device Architecture and Fabrication Strategies for Biomedical Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transparent microelectrode arrays enable simultaneous optical and electrical electrophysiology with high spatiotemporal resolution, allowing multimodal observations of dynamic biological systems. Advances in materials and device architectures improve device performance by addressing key trade‐offs between optical transparency, impedance, and ...
Michael Abraham Listyawan   +6 more
wiley   +1 more source

Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures

open access: yesIEEE Journal of the Electron Devices Society, 2017
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo   +5 more
doaj   +1 more source

Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone

open access: yesScientific Reports, 2022
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper   +4 more
doaj   +1 more source

Wavelength‐Multiplexed 2D Beam Steering via a Passive Diffractive Network

open access: yesAdvanced Optical Materials, EarlyView.
Illustration of a wavelength‐multiplexed diffractive beam steering system, which is composed of K cascaded diffractive layers, each containing phase‐modulating elements that are jointly optimized using deep learning–based optimization. When illuminated with a set of wavelengths {λ1,λ2,…,λNw}$\{ {{{\lambda }_1},{{\lambda }_2},\ldots ,{{\lambda }_{{{N}_w}
Che‐Yung Shen   +5 more
wiley   +1 more source

Enhancements of MEMS design flow for Automotive and Optoelectronic applications [PDF]

open access: yes, 2010
In the latest years we have been witnesses of a very rapidly and amazing grown of MicroElectroMechanical systems (MEMS) which nowadays represent the outstanding state-of-the art in a wide variety of applications from automotive to commercial, biomedical ...
MARCHETTI, ELEONORA
core  

Monolithic integration for photonic applications: MEMS on CMOS and functional BSOI

open access: yes, 2022
Due to exploding use of sensors and actuators in mobile and industrial applications smaller systems combined with low power consumption and higher versatility are required.
Kaden, Christiane, Schulze, Matthias
core   +1 more source

Gαi1/3 Are Essential for BMP2‐Induced Osteogenesis by Bridging BMP Receptors to the Gab1 Signaling Complex

open access: yesAdvanced Science, EarlyView.
The Gαi1/3 protein is a crucial connecting protein closely related to the signal transduction process of bone formation‐related cytokines such as BMP2. Gαi1/3 mediates downstream signaling pathways such as Smads and MAPK by binding to adaptor proteins like Gab1, thereby promoting the osteogenic effect of BMSCs.
Huajian Shan   +10 more
wiley   +1 more source

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

open access: yesProceedings, 2017
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng   +6 more
doaj   +1 more source

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