Results 31 to 40 of about 2,691 (123)

Low-Cost Microbolometer Type Infrared Detectors

Micromachines, 2020
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications.
Le Yu, Yaozu Guo, Haoyu Zhu, Mingcheng Luo, Ping Han, Xiaoli Ji   +5 more
doaj   +1 more source

Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor

Frontiers in Mechanical Engineering, 2022
Environmental sensing units such as gas sensors, humidity sensors, pressure sensors, PM 2.5 sensors, or temperature sensors are widely used in our daily lives. In this study, CMOS-MEMS technology is exploited to fabricate and monolithically integrate the
Ya-Chu Lee, Cheng-Shiun Liou, Tung-Lin Chien, Chingfu Tsou, Weileun Fang, Weileun Fang   +5 more
doaj   +1 more source

Oxidized MoS2‐Based Multifunctional Memristive Hardware for Energy‐Efficient mmWave Signal Processing and In‐Memory Matrix Multiplication

Advanced Functional Materials, EarlyView.
Thermally oxidized MoS2‐based radio‐frequency switches enable a multifunctional platform that unifies broadband RF switching and in‐memory computation. The device achieves a cutoff frequency of 33.2 THz with high energy efficiency and supports hardware‐aware signal processing.
Juho Son, Changwoo Pyo, Sungmoon Park, Yoongi Cho, Seungchan Lee, Myungsoo Kim   +5 more
wiley   +1 more source

Capacitive Sensors and Actuators by CMOS MEMS Foundry

Micromachines
This article introduces the current status of the 0.18-micron CMOS MEMS foundry service platform provided by the Taiwan Semiconductor Research Institute (TSRI), extensively covering the CMOS MEMS components that it has supported in development and ...
Lung-Jieh Yang, Chandrashekhar Tasupalli, Wei-Chen Wang, Yi-Jen Wang, Valliammai Muthuraman, Chi-Yuan Lee   +5 more
doaj   +1 more source

Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles

Advanced Materials, EarlyView.
Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung, Jiaxiang Yi, Hieu Nguyen‐Duc, Tien Nu Hoang Lo, Weili Zhao, Chaoqun Dong, Fabien Sorin, Baris Caglar, Lei Wei, Tung Nguyen‐Dang   +9 more
wiley   +1 more source

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source

Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures

IEEE Journal of the Electron Devices Society, 2017
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo, C. Y. Lin, P. C. Chuang, C. L. Chien, Y. L. Yeh, Stella K. A. Wen   +5 more
doaj   +1 more source

Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone

Scientific Reports, 2022
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper, Daniel Popa, Florin Udrea, Syed Zeeshan Ali, Phillip Stanley-Marbell   +4 more
doaj   +1 more source

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

Advanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu, Mengyao Xiao, Zhouli Sui, Yinpeng Wang, Daoye Zheng, Yuxin Liu, Luwei Wang, Huajun Liu, Chengkuo Lee   +8 more
wiley   +1 more source

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

Proceedings, 2017
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng, C. Y. Yeh, A. Y. Chang, Y. J. Wang, P. C. Chen, H. H. Tsai, Y. Z. Juang   +6 more
doaj   +1 more source