Results 1 to 10 of about 6,180 (208)
(Invited) CMOS MEMS Integration
ECS Transactions, 2011 The "More than Moore" trend in the microelectronics industry is driving a renewed interest in mixed-physics CMOS MEMS integration. Integration becomes a necessity for multi-component microsystems, where interconnect issues are significant. Integration also drives down parasitic capacitances and provides opportunities for ultra-low-power microsystems ...
Gary K. Fedder
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Proceedings of IEEE Sensors, 2003
The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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CMOS MEMS - present and future
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), 2003The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, pre-CMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for ...
H. Baltes +4 more
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CMOS integrated MEMS resonator for RF applications
2006 IEEE International Symposium on Circuits and Systems, 2006The development of a novel fully integrated microelectromechanical system (MEMS) for RF purposes is presented. It is composed of a paddle polysilicon micro-resonator electrostatically excited and a transimpedance CMOS read-out amplifier. The micro-resonator is fabricated directly on a commercial CMOS technology, only requiring a wet etching process for
Arantxa Uranga +8 more
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Built-in self test of CMOS-MEMS accelerometers
Proceedings. International Test Conference, 2003A built-in self-test technique for MEMS that is applicable to symmetrical microstructures is described. A combination of existing layout features and additional circuitry is used to make measurements from symmetrically-located points. In addition to the normal sense output, self-test outputs are used to detect the presence of layout asymmetry that are ...
Nilmoni Deb, R. D. (Shawn) Blanton
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A compact CMOS MEMS microphone with 66dB SNR
2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, 2009Silicon MEMS microphones that offer small size, ease of integration with CMOS electronics, and the ability to withstand lead-free solder reflow cycles, are becoming increasingly popular for high-volume consumer electronic products, and are competing in price and performance with traditional electret condenser microphones [1].
Jelena Citakovic +7 more
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MEMS technology integrated in the CMOS back end
Microelectronics Reliability, 2010The Nanomech™ MEMS technology platform which implements arrays of MEMS devices embedded inside the CMOS back end is described. The key advantages of this integration approach are described in terms of achieving a reliable MEMS technology process within competitive cost requirements, without any need for dedicated process, material and packaging ...
Gaddi R. +8 more
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CMOS-MEMS resonators and their applications
2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC), 2013This paper reports on the recent progress of the high-Q integrated micromechanical resonator, oscillator, and filter using the “CMOS-MEMS technology” to enable monolithic integration of MEMS and IC. The paper scope covers three major parts, including (i) the fabrication technologies of the CMOS-MEMS resonators and their associated circuitry; (ii) the ...
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A CMOS Potentiostat for Control of Integrated MEMS Actuators
2006 IEEE International Symposium on Circuits and Systems, 2006We describe a potentiostat designed for in situ electrochemical control of MEMS actuators. This module is tailored for integration into a hybrid CMOS-MEMS system-on-a-chip to confine cells and measure signals from them. The design has been fabricated in a commercially available 0.5 /spl mu/m CMOS process.
S. B. Prakash +4 more
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Design of CMOS-MEMS infrared emitter arrays
2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2016This paper presents a new design of complementary metal-oxide-semiconductor-microelectromechanical systems (CMOS-MEMS) infrared emitter arrays integrated with metamaterial absorbers (MA). The infrared emitter array is a key IR thermal radiation source for gas sensors.
Zhengxi Cheng, Hiroshi Toshiyoshi
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