Results 41 to 50 of about 2,691 (120)

Phase Noise Reduction in a VHF MEMS-CMOS Oscillator Using Phononic Crystals

open access: yesIEEE Journal of the Electron Devices Society, 2016
This paper presents experimental results showing reduced phase noise in a very high frequency band microelectromechanical systems (MEMS) oscillator. This has been achieved by engineering the embedded MEMS resonator with phononic crystal structures.
Pei Qin   +3 more
doaj   +1 more source

Low-Cost Microbolometer Type Infrared Detectors

open access: yesMicromachines, 2020
The complementary metal oxide semiconductor (CMOS) microbolometer technology provides a low-cost approach for the long-wave infrared (LWIR) imaging applications.
Le Yu   +5 more
doaj   +1 more source

Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor

open access: yesFrontiers in Mechanical Engineering, 2022
Environmental sensing units such as gas sensors, humidity sensors, pressure sensors, PM 2.5 sensors, or temperature sensors are widely used in our daily lives. In this study, CMOS-MEMS technology is exploited to fabricate and monolithically integrate the
Ya-Chu Lee   +5 more
doaj   +1 more source

Broadband Silicon‐On‐Glass Reflective Dielectric Metasurface for THz Beam Steering in 6G Wireless Networks

open access: yesAdvanced Functional Materials, EarlyView.
A CMOS‐compatible, all‐dielectric Silicon‐on‐Glass reflective metasurface enables low–loss terahertz wavefront control for future 6G wireless communication. Mie‐resonant silicon pillars provide full phase coverage near 500 GHz, achieving experimentally validated single‐, dual‐, and five‐beam steering with sub‐1.5° angular error and less than 3 dB ...
Rithwik Premanand   +6 more
wiley   +1 more source

Advanced Manufacturing of Composite‐Based Systems for Energy Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Advanced manufacturing enables the integration of polymers, ceramics, metal oxides, and composites into architected microstructures with tailored transport pathways. By coupling material selection, manufacturing strategy, and structural design, multifunctional energy systems can simultaneously improve electrochemical performance, thermal management ...
Sri Vaishnavi Thummalapalli   +13 more
wiley   +1 more source

Sub‐Terahertz Memristor Switches Using MoS2 by Liquid–Liquid Interface Assembly

open access: yesAdvanced Science, EarlyView.
This work introduces application‐ready sub‐terahertz memristor switches fabricated from electrochemically exfoliated MoS2 nanosheets assembled at a liquid–liquid interface. The devices exhibit robust unipolar resistive switching, low insertion loss, and high isolation across 10–110 GHz.
Tomás Mingates   +15 more
wiley   +1 more source

Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures

open access: yesIEEE Journal of the Electron Devices Society, 2017
In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo   +5 more
doaj   +1 more source

Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone

open access: yesScientific Reports, 2022
We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper   +4 more
doaj   +1 more source

Unconventional Room‐Temperature Antisymmetric Magnetoresistance in van der Waals Fe3GaTe2/Pt Heterostructures

open access: yesAdvanced Science, EarlyView.
We investigated a special electrical phenomenon, known as antisymmetric magnetoresistance with four distinct resistance states, in 2D Fe3GaTe2/Pt devices at room temperature. By designing devices with two separated magnetic nanoflakes, we confirmed that the effect originates from spin–momentum locking rather than magnetic domain walls or interface ...
Yunwen Zhu   +10 more
wiley   +1 more source

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

open access: yesProceedings, 2017
This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng   +6 more
doaj   +1 more source

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