Results 61 to 70 of about 6,180 (208)
Monolithic Multi-Sensor Design With Resonator-Based MEMS Structures
IEEE Journal of the Electron Devices Society, 2017 In this paper, we demonstrated a resonator-based MEMS architecture for multi-sensor SOC applications. A newly developed 0.18 μm 1P6M CMOS ASIC/MEMS process was adopted to integrate MEMS sensor and circuits monolithically.
F. Y. Kuo +5 more
doaj +1 more source
Miniaturized thermal acoustic gas sensor based on a CMOS microhotplate and MEMS microphone
Scientific Reports, 2022 We present a miniaturised thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the physical ...
Richard Hopper +4 more
doaj +1 more source
Advanced Materials Technologies, EarlyView.Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu +8 more
wiley +1 more source
A descriptive model of the current microelectromechanical systems (MEMS) development process [PDF]
, 2009 This paper uses the IDEFØ process modelling technique to present an ‘As-Is' model for the current process of developing generic MEMS devices, this new model is based on information from current practitioners.
Alcock, Jeffrey R. +2 more
core
Zero-level packaging of MEMS in standard CMOS technology
, 2010 A novel technique for global packaging of MEMS devices using standard CMOS technology is presented. A MEMS polysilicon resonator is fabricated and on-chip packaged using two metal layers already available from the CMOS technology.
Torres, Francisco +8 more
core +1 more source
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
Proceedings, 2017 This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by ...
S. H. Tseng +6 more
doaj +1 more source
Study of Free‐Space Optical Quantum Network: Review and Prospectives
Advanced Science, EarlyView.Free from the constraints of fiber connections, free‐space quantum network enables longer and more flexible quantum network connections. This review summarizes and comparatively analyzes free‐space quantum network experiments based on ground stations, satellites, and mobile platforms.
Hua‐Ying Liu, Zhenda Xie, Shining Zhu
wiley +1 more source
A comprehensive high-level model for CMOS-MEMS resonators [PDF]
, 2018 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new ...
Madrenas Boadas, Jordi +5 more
core +1 more source
Engineering Neuronal Network Connectivity Through Precise and Scalable Electrical Modulation
Advanced Science, EarlyView.This study presents a scalable all‐electrical method for precise neuronal‐circuit reconfiguration based on high‐density microelectrode arrays. By employing biologically inspired plasticity rules, targeted connectivity changes were successfully induced and quantified across diverse neuronal preparations.
Sreedhar S. Kumar +10 more
wiley +1 more source
Integration of RF-MEMS resonators on submicrometric commercial CMOS technologies
, 2009 Integration of electrostatically driven and capacitively transduced MEMS resonators in commercial CMOS technologies is discussed. A figure of merit to study the performance of different structural layers and different technologies is defined.
Giner, Joan Josep +8 more
core +1 more source