Results 71 to 80 of about 2,691 (120)
ABSTRACT Photonic matrix processors are attracting attention in applications such as AI inference due to their low‐power and low‐latency properties. However, their applicability has been largely limited to low‐precision computation due to inherent stochastic analog noise and device non‐idealities.
Shoichi Hirasawa, Michihiro Koibuchi
wiley +1 more source
A High-Temperature, Low-Noise Readout ASIC for MEMS-Based Accelerometers
This paper presents the development and measurement results of a complementary metal oxide semiconductor (CMOS) readout application-specific integrated circuit (ASIC) for bulk-silicon microelectromechanical system (MEMS) accelerometers. The proposed ASIC
Min Qi, An-qiang Guo, Dong-hai Qiao
doaj +1 more source
Conducting polymer/metal‐oxide nanocomposites emerge as highly promising chemiresistive sensing materials for environmental gas monitoring. Recent advances reveal strong synergistic effects that enhance sensitivity, selectivity, stability, and response kinetics while enabling lower‐temperature operation.
Katekani Shingange +5 more
wiley +1 more source
A Smart Active Phase-Change Micropump Based on CMOS-MEMS Technology. [PDF]
Jin W +6 more
europepmc +1 more source
A CMOS-MEMS Pixel Sensor for Thermal Neutron Imaging. [PDF]
Mendicino R, Dalla Betta GF.
europepmc +1 more source
Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices
Complementary Metal Oxide Semiconductor (CMOS) and Micro-Electro-Mechanical System (MEMS) devices play significant roles in emerging research fields such as artificial intelligence (AI) [...]
Zhiming Chen
doaj +1 more source
Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique. [PDF]
Shen YX, Tsai YC, Lee CY, Wu CC, Dai CL.
europepmc +1 more source
The integration of complementary metal–oxide–semiconductor (CMOS) and micro-electromechanical systems (MEMSs) technologies for miniaturized biosensor fabrication enables unprecedented spatiotemporal resolution in monitoring the bioelectrical activity of ...
Gabor Orban +6 more
doaj +1 more source
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source
A highly stable, nanotube-enhanced, CMOS-MEMS thermal emitter for mid-IR gas sensing. [PDF]
Popa D +13 more
europepmc +1 more source

