Results 81 to 90 of about 6,180 (208)

Parametric Analysis of Spiking Neurons in 16 nm Fin Field‐Effect Transistor Technology

Advanced Intelligent Discovery, EarlyView.
Energy efficient computing has driven a shift toward brain‐inspired neuromorphic hardware. This study explores the design of three distinct silicon neuron topologies implemented in 16 nm fin field‐Effect transistor technology. While the Axon‐Hillock design achieves gigahertz throughput, its functional fragility persists. The Morris–Lecar model captures
Logan Larsh, Raiyan Siddique, Sarah S. Sharif, Yaser Mike Banad   +3 more
wiley   +1 more source

Multi-level and multidisciplinary optimisation of microelectromechanical systems [PDF]

, 2012
A comparative investigation into the role multi-level and multidisciplinary design optimisation can play in the automated design synthesis of microelectromechanical systems (MEMS) is presented.
Farnsworth, Michael
core  

Optimization of CMOS MEMS microwave power sensors [PDF]

ISCAS'99. Proceedings of the 1999 IEEE International Symposium on Circuits and Systems VLSI (Cat. No.99CH36349), 2003
To improve sensitivity and signal-to-noise ratio, while maintaining microwave performance, several design parameters must be considered, such as the number and placement of thermocouples. This paper presents experimental and analytical thermal characterization of the sensors, which provides insight into the proper adjustment of the layout parameters ...
Veljko Milanovic, Matt Hopcroft, Christian A. Zincke, Michael Gaitan, Mona E. Zaghloul   +4 more
openaire   +1 more source

Neuromorphic Denoising with Fully Analog Memristive In‐Memory Computing

Advanced Intelligent Systems, EarlyView.
This article borrows the concepts of episodic memory in human brains to experimentally implement a memristor‐based neuromorphic denoising process. A homogeneous memristor processing unit is experimentally demonstrated for both temporal storage and neural network computation, imitating the synapses in the human brain.
Daijing Shi, Teng Zhang, Yuqi Li, Yaoyu Tao, Bonan Yan, Yuchao Yang   +5 more
wiley   +1 more source

Study of the communication distance of a MEMS Pressure Sensor Integrated in a RFID Passive Tag

Advances in Electrical and Computer Engineering, 2012
The performance of a MEMS (Micro Electro-Mechanical Systems) Sensor in a RFID system has been calculated, simulated and analyzed. It documents the viability - from the power consumption point of view - of integrating a MEMS sensor in a passive tag ...
FERNANDEZ, I., ASENSIO, A., GUTIERREZ, I., GARCIA, J., REBOLLO, I., de NO, J.   +5 more
doaj   +1 more source

Design and analysis of piezoelectric MEMS micro‐speaker based on scandium‐doped AlN thin film

Micro & Nano Letters, 2021
Piezoelectric MEMS microspeakers are promising candidates for miniaturized speakers, such as for in‐ear applications. Using lead‐free scandium doped aluminium nitride (ScAlN) thin film instead of lead zirconium titanate helps these speakers to be ...
Ahmed Fawzy, Yiming Lang, Menglun Zhang
doaj   +1 more source

Perovskite Photodetectors at the Intelligence Frontier: From Tunable Materials to Adaptive Optoelectronic Systems

Carbon Energy, EarlyView.
This comprehensive review presents a progressive roadmap for perovskite vision detectors. Centered on perovskite‐based artificial perception, the graphic illustrates a systematic evolution: starting with fundamental material engineering and device architectures, advancing toward complex functional strategies such as flexible neuromorphic imaging ...
Chenglong Li, Wei Qu, Deepak Kumar, Naini Jain, Nur Wardina Syahirah binti Mohamad Fadil, Nur Najiha binti Ahmad Rasid, Emannuel Kymakis, Maria Vasilopoulou, Chunxiong Bao, Feng Gao, Peng Gao, Sanjeev Kumar Sharma, Mohammad Khaja Nazeeruddin, Abd. Rashid bin Mohd Yusoff, Haotong Wei   +14 more
wiley   +1 more source

3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding

, 2022
Paper 951709, 12 S.Technologies for the 3D integration are described within this paper with respect to devices that have to retain a specific minimum wafer thickness for handling purposes (CMOS) and integrity of mechanical elements (MEMS).
Reuter, Danny, Gottfried, Knut, Schulz, Stefan E., Ecke, Ramona, Hofmann, Lutz, Dempwolf, S., Knechtel, R., Geßner, Thomas   +7 more
core   +1 more source

Miniaturized Thermal Acoustic Gas Sensor Based on a CMOS Microhotplate and MEMS Microphone

Proceedings, 2020
In this work, we present a novel thermal acoustic gas sensor, fabricated using a CMOS microhotplate and MEMS microphone. The sensing mechanism is based on the detection of changes in the thermal acoustic conversion efficiency which is dependent on the ...
Richard Hopper, Daniel Popa, Vasileios Tsoutsouras, Florin Udrea, Phillip Stanley-Marbell   +4 more
doaj   +1 more source

Nanophotonic Biosensors and the Paradigm of Trans‐Scale Autonomous Bio‐Integrated Diagnostics for Addressing Health Complexities

Electron, EarlyView.
Physics‐driven advances in optical nanobiosensors for rapid, miniaturized, and point‐of‐care diagnostics for next‐generation decentralized and personalized healthcare based on sensor intelligence. ABSTRACT Public health emergencies and the escalating burden of chronic diseases necessitate a paradigm shift from centralized laboratory testing to rapid ...
Vishal Chaudhary, Harsh Sable, Sonu Sonu, Lakshita Phor, Reddicherla Umapathi, Pradeep Bhadola   +5 more
wiley   +1 more source