Results 91 to 100 of about 2,629 (140)
Some of the next articles are maybe not open access.
Microelectronics Reliability, 2000
Abstract Two case studies of packaging for sensor microsystems based on CMOS IC technology with post-CMOS micromachining and film deposition are presented. The first case includes a filter directly attached to the CMOS chip and a plastic ball grid array as first level packaging for CMOS integrated thermoelectric sensor arrays used for intrusion ...
Henry Baltes, Oliver Brand, Marc Waelti
openaire +1 more source
Abstract Two case studies of packaging for sensor microsystems based on CMOS IC technology with post-CMOS micromachining and film deposition are presented. The first case includes a filter directly attached to the CMOS chip and a plastic ball grid array as first level packaging for CMOS integrated thermoelectric sensor arrays used for intrusion ...
Henry Baltes, Oliver Brand, Marc Waelti
openaire +1 more source
2014 IEEE International Frequency Control Symposium (FCS), 2014
To greatly enhance the performance of our previously developed CMOS-MEMS resonant gate field effect transistor (RGFET) [1], a novel CMOS-MEMS RGFET array which combines a metal/oxide composite resonant-gate arrayed structure and a FET arrayed transducer has been proposed for the first time utilizing the TSMC 0.35 μm CMOS technology together with a ...
Chi-Hang Chin, Sheng-Shian Li
openaire +1 more source
To greatly enhance the performance of our previously developed CMOS-MEMS resonant gate field effect transistor (RGFET) [1], a novel CMOS-MEMS RGFET array which combines a metal/oxide composite resonant-gate arrayed structure and a FET arrayed transducer has been proposed for the first time utilizing the TSMC 0.35 μm CMOS technology together with a ...
Chi-Hang Chin, Sheng-Shian Li
openaire +1 more source
RF CMOS-MEMS cantilever resonator
2013 IEEE International Conference on Smart Instrumentation, Measurement and Applications (ICSIMA), 2013This paper presents use of the simple cantilever beam as RF CMOS-MEMS resonator, which can be scaled like transistor with improved performance. This resonator can be used in the oscillator and filter part of RF transceiver, which can actually be fabricated on chip without losing its Q-factor. The cantilever beam resonator was designed using COMSOL4.3b™
A. Anwar Zainuddin +5 more
openaire +1 more source
Ultra-wideband CMOS-MEMS radio
2009 IEEE International Conference on Ultra-Wideband, 2009Current ultrawideband (UWB) radios have several unsolved issues in front-end performance including difficult and expensive clock synthesizer designs, and power hungry baseband functions. In fact, the expected breakthrough of the very useful UWB technology has stalled since realized high bitrate integrated radios are much too expensive in the sense that
Esa Tiiliharju +4 more
openaire +1 more source
CMOS-MEMS atomic force microscope
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, 2011We present a CMOS-MEMS atomic force microscope (AFM) with integrated 3-D MEMS actuation and 3-axis position sensing. CMOS driving and sensing electronics have been integrated in the same fabrication process. Our goal is to replace piezoelectric positioning systems which are bulky (leading to thermal drift and poor vibration immunity) and suffer from ...
N. Sarkar +3 more
openaire +1 more source
CMOS–MEMS Lateral Electrothermal Actuators
Journal of Microelectromechanical Systems, 2008In this paper, a type of lateral electrothermal (ET) actuator fabricated with post-CMOS micromachining is presented. The actuator is a beam with a multimorph structure, composed of CMOS dielectric and metal interconnect. Following structural release, the actuators demonstrate self-assembly under the moments arising from residual stress.
P.J. Gilgunn +3 more
openaire +1 more source
CMOS MEMS - present and future
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), 2003The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, pre-CMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for ...
H. Baltes +4 more
openaire +1 more source
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design - ICCAD '06, 2006
CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
openaire +1 more source
CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
openaire +1 more source
CMOS-MEMS Capacitive Humidity Sensor
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems, 2009This paper reports a method for improving the sensitivity of integrated capacitive chemical sensors by removing the underlying substrate. The sensor is integrated with CMOS testing electronics using mask-less post-processing followed by inkjet deposition of sensitive polymer.
Nathan Lazarus +3 more
openaire +1 more source