Results 81 to 90 of about 392,135 (196)

A High-Temperature, Low-Noise Readout ASIC for MEMS-Based Accelerometers

Sensors, 2019
This paper presents the development and measurement results of a complementary metal oxide semiconductor (CMOS) readout application-specific integrated circuit (ASIC) for bulk-silicon microelectromechanical system (MEMS) accelerometers. The proposed ASIC
Min Qi, An-qiang Guo, Dong-hai Qiao
doaj   +1 more source

CMOS-MEMS Resonators and Oscillators : A Review

, 2018
In this paper, we summarize research activities and technological progress in the field of current CMOS-MEMS resonators and oscillators for portable sensor node and timing applications.
Chao-Yu Chen, Ming-Huang Li, Sheng-Shian Li   +2 more
semanticscholar   +1 more source

A Smart Active Phase-Change Micropump Based on CMOS-MEMS Technology. [PDF]

Sensors (Basel), 2023
Jin W, Guan Y, Wang Q, Huang P, Zhou Q, Wang K, Liu D.   +6 more
europepmc   +1 more source

A CMOS-MEMS Pixel Sensor for Thermal Neutron Imaging. [PDF]

Micromachines (Basel), 2023
Mendicino R, Dalla Betta GF.
europepmc   +1 more source

Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices

Micromachines
Complementary Metal Oxide Semiconductor (CMOS) and Micro-Electro-Mechanical System (MEMS) devices play significant roles in emerging research fields such as artificial intelligence (AI) [...]
Zhiming Chen
doaj   +1 more source

Piezoelectric aluminum nitride thin films for CMOS compatible MEMS: Sputter deposition and doping

Critical reviews in solid state and materials sciences
Amongst the piezoelectric thin films suited for microelectromechanical systems (MEMS), AlN has gained particular technological relevance due to its unique material properties (large bandgap, high dielectric strength, resistivity, thermal conductivity ...
S. Sandeep, Rui M. R. Pinto, Jyothilakshmi Rudresh, V. Gund, K. K. Nagaraja, K. Vinayakumar   +5 more
semanticscholar   +1 more source

Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique. [PDF]

Micromachines (Basel), 2022
Shen YX, Tsai YC, Lee CY, Wu CC, Dai CL.
europepmc   +1 more source

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

Micromachines, 2018
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh, Hideyuki Fukushi, Masayoshi Esashi, Shuji Tanaka   +3 more
doaj   +1 more source

A highly stable, nanotube-enhanced, CMOS-MEMS thermal emitter for mid-IR gas sensing. [PDF]

Sci Rep, 2021
Popa D, Hopper R, Ali SZ, Cole MT, Fan Y, Veigang-Radulescu VP, Chikkaraddy R, Nallala J, Xing Y, Alexander-Webber J, Hofmann S, De Luca A, Gardner JW, Udrea F.   +13 more
europepmc   +1 more source

Design Considerations of an Analog Voltage Mode Readout Circuit for the CMOS-SOI-MEMS Gas Sensor Dubbed GMOS

Micromachines
Modern gas sensor technology is becoming an important part of our lives. Hence, there has been considerable effort over the past 25 years towards the goal of creating low-cost gas sensors by employing modern microelectronics technology to manufacture ...
Efraim-Lavi Bukshish, Sharon Bar-Lev, Tanya Blank, Yael Nemirovsky   +3 more
doaj   +1 more source