Results 111 to 120 of about 7,213 (255)

A High-Temperature, Low-Noise Readout ASIC for MEMS-Based Accelerometers

open access: yesSensors, 2019
This paper presents the development and measurement results of a complementary metal oxide semiconductor (CMOS) readout application-specific integrated circuit (ASIC) for bulk-silicon microelectromechanical system (MEMS) accelerometers. The proposed ASIC
Min Qi, An-qiang Guo, Dong-hai Qiao
doaj   +1 more source

Human Heat Energy Harvesting Using Thermoelectric Cooler [PDF]

open access: yes, 2014
An extensive research in renewable energy harvesting is increasing due to the limitation of energy resources. The known leading renewable energy harvesting sources is such as hydroelectricity, wind and solar.
Wong , Hui Ping
core  

The scale matters: A review on stimuli‐responsive microrobots categorized by scale for biomedical applications

open access: yesResponsive Materials, EarlyView.
We systematically summarize how each scale dictates fundamental choices in design feature, manufacturing technology, driving mechanism, and control strategy, which are inherently governed by scale‐dominated physical principles. Furthermore, the application of scale‐determined operation modes of microrobots across different stages of medical ...
Hang Yin   +3 more
wiley   +1 more source

A quad‐cistronic fluorescent biosensor system for real‐time detection of subcellular Ca2+ signals

open access: yesBritish Journal of Pharmacology, EarlyView.
Background and Purpose The calcium ion (Ca2+) is a versatile cellular messenger regulating a variety of biological processes. Compounds modulating subcellular Ca2+ signals hold substantial pharmacological potential. Advances in fluorescent biosensors have revolutionised Ca2+ imaging.
Anna Lischnig   +7 more
wiley   +1 more source

Coaxial Dipole Array With Switching Transmit Sensitivities for Ultrahigh Field MRI

open access: yesMagnetic Resonance in Medicine, Volume 95, Issue 6, Page 3608-3615, June 2026.
ABSTRACT Purpose To investigate dipole antennas with electronically switchable transmit field patterns to improve flip angle homogeneity in ultra‐high field MRI. Methods Reconfigurable dipole elements that could produce two distinct electronically switchable B1+ field profiles were conceptualized and constructed.
Dario Bosch   +5 more
wiley   +1 more source

A Smart Active Phase-Change Micropump Based on CMOS-MEMS Technology. [PDF]

open access: yesSensors (Basel), 2023
Jin W   +6 more
europepmc   +1 more source

Electrically Reconfigurable Quasi‐BIC Metadevices Enabled by Integrated Barium Titanate

open access: yesNanophotonics, Volume 15, Issue 9, 13 May 2026.
An electrically reconfigurable quasi‐BIC metasurface is demonstrated by monolithic integration of barium titanate. Leveraging the Pockels effect, linear tuning of 1.79 nm/V is achieved, enabling a 250 μm2 miniaturized spectrometer with 0.2 nm resolution, 99% fidelity, and high throughput.
Jingyi Xia   +5 more
wiley   +1 more source

Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices

open access: yesMicromachines
Complementary Metal Oxide Semiconductor (CMOS) and Micro-Electro-Mechanical System (MEMS) devices play significant roles in emerging research fields such as artificial intelligence (AI) [...]
Zhiming Chen
doaj   +1 more source

Multibit Ferroelectric HfZrO Memcapacitor for Non‐Volatile Analogue Memory and Reconfigurable Electronics

open access: yesAdvanced Functional Materials, Volume 36, Issue 37, 7 May 2026.
Ferroelectric memcapacitors enable non‐volatile, voltage‐programmable capacitance tuning for adaptive electronics. A TiN/HfZrO/TiN device stack demonstrates more than eight stable capacitance states within a 24 pF memory window in compact 60 ×$\times$ 60 μm2$\umu{\rm m}^{2}$ devices at low operating voltages.
Deepika Yadav   +6 more
wiley   +1 more source

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

open access: yesMicromachines, 2018
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh   +3 more
doaj   +1 more source

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