Results 21 to 30 of about 2,964,989 (237)
As we all know, the International Symposium on Integrated Circuits and Systems (ISICAS) is a Emerging forum for the presentation of high-quality original work in the areas of integrated circuits and systems.
Zhihua Wang
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Carbon nanotube-based three-dimensional monolithic optoelectronic integrated system
Single-material monolithic optoelectronic integrated circuits via CMOS compatible low-temperature approaches are crucial to the continued development of post-Moore electronics.
Yang Liu +3 more
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Solution-processable integrated CMOS circuits based on colloidal CuInSe2 quantum dots
Designing efficient toxic-element-free technologies in solution-processable CMOS electronics remains a challenge. Here, the authors demonstrate integrated logic CMOS circuits based on heavy-metal-free colloidal CuInSe2 quantum dots with low switching ...
Hyeong Jin Yun +5 more
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Radiation Effects in CMOS Isolation Oxides: Differences and Similarities With Thermal Oxides [PDF]
Radiation effects in thick isolation oxides of modern CMOS technologies are investigated using dedicated test structures designed using two commercial foundries.
Martinez, Martial +11 more
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Characterization and Design of Analog Integrated Circuits Exploiting Analog Platforms [PDF]
Universal Mobile Telecommunication System (UMTS) front end design is challenging because of the need to optimize power while satisfying a very high dynamic range requirement. At the same time, designing analog circuits for automotive applications is very
Vincis, Federico
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Carbon nanotubes (CNTs) can be grown locally on custom-designed CMOS microstructures to use them as a sensing material for manufacturing low-cost gas sensors, where CMOS readout circuits are directly integrated.
Avisek Roy +4 more
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Energy-Efficient Amplifiers Based on Quasi-Floating Gate Techniques
Energy efficiency is a key requirement in the design of amplifiers for modern wireless applications. The use of quasi-floating gate (QFG) transistors is a very convenient approach to achieve such energy efficiency.
Antonio Lopez-Martin +5 more
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Wafer-Scale 3D Integration for High-Density Multi-Valued Neuromorphic Logic. [PDF]
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Kim CH +5 more
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Compact modelling in RF CMOS technology [PDF]
With the continuous downscaling of complementary metal-oxide-semiconductor (CMOS) technology, the RF performance of metal-oxide-semiconductor field transistors (MOSFETs) has considerably improved over the past years.
Liu, Jun
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SC-DDPL as a Countermeasure against Static Power Side-Channel Attacks
With the continuous scaling of CMOS technology, which has now reached the 3 nm node at production level, static power begins to dominate the power consumption of nanometer CMOS integrated circuits.
Davide Bellizia +2 more
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