Results 121 to 130 of about 161,284 (157)
Regulating Light Absorption, Charge Orientation, and Oxygen Activation of Conjugated Porous Polymers for Photocatalytic Organic Synthesis. [PDF]
Acc Mater ResGao Z, Li S, Tang J, Yuan J, Yu G.
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Proceedings of the 3rd ACM/IEEE Symposium on Architecture for networking and communications systems, 2007
Packet classification is central to modern network functionality, yet satisfactory memory usage and performance remains elusive at the highest speeds. The recent emergence of low-cost, highly parallel architectures provides a promising platform on which to realize increased classification performance.
Randy Smith, Dan Gibson, Shijin Kong
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Packet classification is central to modern network functionality, yet satisfactory memory usage and performance remains elusive at the highest speeds. The recent emergence of low-cost, highly parallel architectures provides a promising platform on which to realize increased classification performance.
Randy Smith, Dan Gibson, Shijin Kong
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Proceedings of the 19th ACM Great Lakes symposium on VLSI, 2009
This paper proposes a new architecture of variability-tolerant chip-multiprocessor. To mitigate the impact of process variability on throughput and power, voltage and frequency islands are introduced into chip-multiprocessors. Thus, voltage island frequency island chip-multiprocessors enable per-core scaling on the supply voltage and operating ...
Wan-Yu Lee, Iris Hui-Ru Jiang
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This paper proposes a new architecture of variability-tolerant chip-multiprocessor. To mitigate the impact of process variability on throughput and power, voltage and frequency islands are introduced into chip-multiprocessors. Thus, voltage island frequency island chip-multiprocessors enable per-core scaling on the supply voltage and operating ...
Wan-Yu Lee, Iris Hui-Ru Jiang
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The Compatibility of Copper CMP Slurries with CMP Requirements
Journal of The Electrochemical Society, 2003Cu is currently used as a replacement for aluminum in IC interconnections. One of the challenges of integrated circuit (IC) interconnection technology is the planarization process that involves fine copper lines patterning; the most perspective technique for Cu lines patterning is chemical mechanical planarization (CMP).
Y. Ein-Eli +3 more
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Soft CMP pads for low defectivity in CMP processes
Proceedings of International Conference on Planarization/CMP Technology 2014, 2014New approaches to soft polyurethane materials have been developed with the characteristics of high texturability and tunability in physical properties. The approach has resulted in low defectivity and high performance stability in a range of sensitive CMP applications, including copper barrier applications.
null Fengji Yeh +5 more
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Proceedings of the 15th international symposium on System Synthesis - ISSS '02, 2002
This paper briefly sketches the current issues of chip multiprocessor (CMP) design for system LSI chip from the viewpoint of computer architects.
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This paper briefly sketches the current issues of chip multiprocessor (CMP) design for system LSI chip from the viewpoint of computer architects.
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Application of a CMP Model to Tungsten CMP
Journal of The Electrochemical Society, 2001A general model of chemical mechanical polishing (CMP) has been derived which shows the dependence of the polishing rate on the concentration of chemicals and abrasives in the slurry. This paper applies the model to tungsten CMP and describes the chemistry of tungsten CMP in some detail.
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NIR Monitoring of CMP Slurries and Post-CMP Cleaning Solutions
ECS Transactions, 2009The Near Infrared Spectroscopy (NIR) is a powerful analytical technique and process control tool, capable of providing simultaneous qualitative and quantitative information on both, solid and dissolved components of CMP slurries, as well as cleaning solutions.
Eugene Shalyt +3 more
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