Results 121 to 130 of about 36,341 (164)
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Soft CMP pads for low defectivity in CMP processes
Proceedings of International Conference on Planarization/CMP Technology 2014, 2014New approaches to soft polyurethane materials have been developed with the characteristics of high texturability and tunability in physical properties. The approach has resulted in low defectivity and high performance stability in a range of sensitive CMP applications, including copper barrier applications.
null Fengji Yeh +5 more
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CMP-KDO synthetase: Overproduction and application to the synthesis of CMP-KDO and analogs
Bioorganic & Medicinal Chemistry, 1995CTP:CMP-3-deoxy-manno-octulosonate cytidylyltransferase (CMP-KDO synthetase, EC 2.7.7.38) has been cloned and overexpressed in Escherichia coli. The structure gene was amplified from the total DNA of E. coli K-235 through the primer-directed polymerase chain reaction.
T, Sugai, C H, Lin, G J, Shen, C H, Wong
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Surface Preparation in CMP Process; Post CMP Cleaning and Defects
ECS Meeting Abstracts, 2007Abstract not Available.
Jin-Goo Park, Tae-Gon Kim
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Test Generation for CMP Designs
2010 11th International Workshop on Microprocessor Test and Verification, 2010Full-chip simulation of multicore designs is an important element in the design verification cycle of a Chip Multiprocessor (CMP). Random tests are typically applied to the Multiprocessor (MP) in order to stimulate unexercised states of the machine. Completely random MP tests generally provide inadequate coverage, especially as the core count increases.
Padmaraj Singh, David L. Landis
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NIR Monitoring of CMP Slurries and Post-CMP Cleaning Solutions
ECS Transactions, 2009The Near Infrared Spectroscopy (NIR) is a powerful analytical technique and process control tool, capable of providing simultaneous qualitative and quantitative information on both, solid and dissolved components of CMP slurries, as well as cleaning solutions.
Eugene Shalyt +3 more
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Heuristics for Flexible CMP Synthesis
IEEE Transactions on Computers, 2010Flexible Chip Multiprocessor (CMP) systems are implemented on field programmable devices to exploit both task-level parallelism and architecture customization for parallel programs. The idea is to simultaneously allocate processor resources, map and schedule tasks to them, and to allocate one or several intertask communication resources such that the ...
Harold Ishebabi, Christophe Bobda
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NoC Reconfiguration for CMP Virtualization
2011 IEEE 10th International Symposium on Network Computing and Applications, 2011At NoC level, the traffic interferences can be drastically reduced by using virtualization mechanisms. An effective strategy to virtualize a NoC consists in dividing the network in different partitions, each one serving different applications and traffic flows.
Francisco Triviño +3 more
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News from the M in CMP - Viscosity of CMP Slurries, a Constant?
MRS Proceedings, 2003AbstractIt is well known and accepted that the viscosity of CMP-slurries has an effect on polishing results. Even though the literature on rheology recognizes that viscosity is not always constant and the slurry can show non-Newtonian behavior or even dilatant effects, all calculations have been performed with constant viscosity.However, the “real ...
W. Lortz +5 more
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Results for the revised set of CMPs, including a CMP with no cap.
2018Performance statistics are contrasted for seven CMPs: three options for the b control parameter crossed with two options for the cap on the TAC, and further a no cap option for the b+5% option. Despite a higher average catch, the no cap option seems undesirable because of poor lower 5%ile depletion and high AAV values.
Ross-Gillespie, Andrea +1 more
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MRS Bulletin, 2002
AbstractChemical–mechanical polishing, or planarization (CMP), is one of several advanced microfabrication processes that provide complementary capabilities for constructing advanced electronic devices. At the current state of the art, CMP demonstrates significant advantages due to its high degree of process flexibility, particularly in the chemical ...
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AbstractChemical–mechanical polishing, or planarization (CMP), is one of several advanced microfabrication processes that provide complementary capabilities for constructing advanced electronic devices. At the current state of the art, CMP demonstrates significant advantages due to its high degree of process flexibility, particularly in the chemical ...
openaire +1 more source