A holistic approach to lead pipe scale analysis: Importance, methodology, and limitations. [PDF]
AWWA Water Sci, 2022 Harmon SM +5 more
europepmc +1 more source
Comparison of the self-healing behaviour of 60Sn40Pb and 99.3Sn0.7Cu solder alloy reinforced Al6061 MMCs’. [PDF]
The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs'; the self-healing properties have been ...
Kumar, Gonal Basavaraja Veeresh +5 more
core +1 more source
Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers. [PDF]
Materials (Basel), 2020 Mirski Z, Ciepacz I, Wojdat AT.
europepmc +1 more source
NASA Tech Briefs, July 1990 [PDF]
Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life ...
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Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders [PDF]
, 2018 : Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also ...
core
Electronic packaging - A bibliography [PDF]
Annotated bibliography of literature on electronic packaging for use in designing electronic ...
Easterday, J. L. +3 more
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TEMPERATURE AND RATE DEPENDENT PARTITIONED CONSTITUTIVE RELATIONSHIPS FOR 95.5PB2SN2.5AG SOLDER ALLOY [PDF]
, 2004 One of the biggest challenges for power electronic devices is to be reliable in harsh environments. The operating temperatures in typical applications can go as high as 200ºC.
Gupta, Shirish Anurag
core
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder. [PDF]
Micromachines (Basel), 2018 Long X +5 more
europepmc +1 more source
Analytical and numerical modeling of creep with damage in a solder alloy [PDF]
LAUREA MAGISTRALEQuesto lavoro ha come obbiettivo lo studio del comportamento a creep delle saldature in SAC305 tipiche dei circuiti stampati e sottoposte a carichi di taglio ciclici. Il primo modello di studio è uno di tipo elastico-creep.
Renzi, Luca
core
Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. [PDF]
Sci Rep, 2016 Li MY +4 more
europepmc +1 more source