Results 71 to 80 of about 2,155,829 (107)

A holistic approach to lead pipe scale analysis: Importance, methodology, and limitations. [PDF]

AWWA Water Sci, 2022
Harmon SM, Tully J, DeSantis MK, Schock MR, Triantafyllidou S, Lytle DA.   +5 more
europepmc   +1 more source

Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders

, 2005
Quaternary Sn–Ag–Cu–Ni composite solders were made with several different ratios of Cu/Ni to study the effect of Cu/Ni on the type of intermetallic compound phase at the joint interface. The eutectic solders of Sn–3.5Ag and Sn–3.5Ag–0.7C (numbers are all
Zin Hyoung Lee, Joo Won Lee, Lee, ZH, Lee, HyuckMo, Lee, JW, Hyuck Mo Lee   +5 more
core   +1 more source

Diffusion of Environmental Awareness [PDF]

, 2017
A high level of “environmental awareness” in the participating countries will likely raise the success of the Kyoto Protocol negotiated in Paris in 2015.
Wiesmeth, Hans, Okhrin, Ostap, Lösch, Stefanie   +2 more
core   +1 more source

Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers. [PDF]

Materials (Basel), 2020
Mirski Z, Ciepacz I, Wojdat AT.
europepmc   +1 more source

Microstructure Influence of SACX0307-TiO₂ Composite Solder Joints on Thermal Properties of Power LED Assemblies. [PDF]

Materials (Basel), 2020
Skwarek A, Ptak P, Górecki K, Hurtony T, Illés B.   +4 more
europepmc   +1 more source

Reaction-Diffusion in Co2Si/Zn Diffusion Couple

Periodic layered structures were examined in the Co₂Si/Zn diffusion couple annealed at 390 °C. SEM, TEM, EPMA, and XRD analyses revealed alternating Co–Si–rich and Zn–rich layers composed of CoSi, γ₁, and γ₂ phases with cell-to-cell variations in ...
Cserháti, Csaba, Tamel, Doga, Yee, May Swann Sint, Sárközi, Barbara, Erdélyi, Zoltán   +4 more
core   +1 more source

Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder. [PDF]

Micromachines (Basel), 2018
Long X, Zhang X, Tang W, Wang S, Feng Y, Chang C.   +5 more
europepmc   +1 more source

Advanced Materials and Processing Technologies. [PDF]

Materials (Basel)
Ćurković L, Jozić S, Žmak I.
europepmc   +1 more source

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. [PDF]

Sci Rep, 2016
Li MY, Yang HF, Zhang ZH, Gu JH, Yang SH.   +4 more
europepmc   +1 more source

Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]

Nano Converg
Ju YM, Kim TW, Lee SH, Lee HJ, Ahn J, Kim HS.   +5 more
europepmc   +1 more source