Results 61 to 70 of about 77 (71)

Effect of Thermal Processing on the Dissolution of Micro/Nano-Size Metal Particles in Lead-Free Composite Solders

2009
Wang Guo-Xiang
exaly  

A study of the composition dependence of the rapid hardening phenomenon in Al–Cu–Mg alloys using diffusion couples

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2012
S P Ringer, C R Hutchinson, R K W Marceau   +2 more
exaly  

Modeling of Micro/Nano-Particle Dissolution During Reflow of Lead-Free Composite Solders

2010
Wang Guo-Xiang
exaly  

Deformation-induced nanocrystallization and its influence on work hardening in a bulk amorphous matrix composite

Acta Materialia, 2004
Byeong-Joo Lee, Sung-Hak Lee, Yu-Chan Kim   +2 more
exaly  

Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

Journal of Alloys and Compounds, 2015
exaly  

Effects of graphene nanosheets on the intermetallic compounds layer between Sn-Ag-Cu lead-free solders and Cu substrates

2015
Lianyong Xu
exaly  

Oxygen boost diffusion for the deep-case hardening of titanium alloys

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2000
exaly  

Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders

2009
A A O Tay, V Kripesh
exaly  

Research advances in nano-composite solders

Microelectronics Reliability, 2009
exaly  

Composite solders

IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1991
exaly