Results 41 to 50 of about 538 (115)
Batteries &Supercaps, Volume 9, Issue 5, May 2026.Lithium‐ion batteries used in space applications are exposed to extreme conditions, including radiation, vacuum, wide temperature fluctuations, and long storage times, all of which accelerate degradation. This review article summarizes the main degradation mechanisms affecting battery performance in space environments, including capacity fade ...
Xunkai Chen, Kelsey B. Hatzell
wiley +1 more source
The durability of solder joints under thermo-mechanical loading; application to Sn-37Pb and Sn-3.8Ag-0.7Cu lead-free replacement alloy [PDF]
, 2015 Solder joints in electronic packages provide mechanical, electrical and thermal connections. Hence, their reliability is also a major concern to the electronic packaging industry. Ball Grid Arrays (BGAs) are a very common type of surface mount technology
Ghaleeh, Mohammad
core
ChemistryOpen, Volume 15, Issue 5, May 2026.This review summarizes recent advances in the synthesis and processing of carbon nanotubes and carbon nanocomposites, highlighting structure–property relationships and their applications in energy storage, biomedical systems, and environmental technologies, with emphasis on performance optimization and sustainable material design.
Noor‐ul‐Huda Altaf +9 more
wiley +1 more source
Progress in Photovoltaics: Research and Applications, Volume 34, Issue 5, Page 555-566, May 2026.This study investigates high‐mobility, low carrier concentration (CC) transparent conducting oxides (TCOs) as back contacts in bifacial Cu (In, Ga)Se2 (CIGS) solar cells. These TCOs enhance rear‐side light absorption in CIGS and external quantum efficiency, improving overall performance by offering high transparency, low reflectance, and maintaining ...
Nisika Nisika +6 more
wiley +1 more source
The Effects of Thermal Aging on the Mechanical Behavior of Fine Pitch Electronics Packages [PDF]
, 2013 The direction of Electronics packaging industry is to design smaller packages with higher complexity while focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly. While performance capabilities have increased, thermo-mechanical
Vijayakumar, Namo Pankaj
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3D‐Printed Giant Magnetoresistive (GMR) Sensors Based on Self Compliant Springs
Advanced Engineering Materials, Volume 28, Issue 8, 22 April 2026.This work explores 3D‐printed GMR sensors utilizing self‐compliant spring structures and conductive PLA composites. By optimizing arm width, we achieved high piezoresistive (0.34%/mm) and magnetoresistive (0.77%/mT) sensitivities. Demonstrated through Bluetooth‐integrated pressure and magnetic position sensing, these full printed low‐cost, customizable
Josu Fernández Maestu +4 more
wiley +1 more source
Nonterrestrial utilization of materials: Automated space manufacturing facility [PDF]
, 1982 Four areas related to the nonterrestrial use of materials are included: (1) material resources needed for feedstock in an orbital manufacturing facility, (2) required initial components of a nonterrestrial manufacturing facility, (3) growth and ...
core +1 more source
Selective soldering nozzles:insights into wear mechanisms and future developments [PDF]
, 2023 Selective soldering utilises wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear of the nozzle due to chemical interaction between the solder and ...
Cobley, Andrew +3 more
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Materials review for improved automotive gas turbine engine [PDF]
The potential role of superalloys, refractory alloys, and ceramics in the hottest sections of engines operating with turbine inlet temperatures as high as 1370 C is examined.
Belleau, C., Ehlers, W. L., Hagen, F. A.
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Analysis of inhomogeneous materials at large strains using fast Fourier transform
, 2003 invited lecture at the IUTAM Symposium - Stuttgart 2001International audienceThis paper focuses on a numerical method which has been recently developed to analyze the response of highly inhomogeneous materials, often with complex microstructure.
Lahellec, Noël +3 more
core +1 more source