Results 31 to 40 of about 538 (115)
Advanced Science, EarlyView.Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh +8 more
wiley +1 more source
Fatigue Properties and Reliability of Solder Joints in BGA Assembly [PDF]
, 2022 Lead-free near-eutectic Sn-Ag-Cu (SAC) solder system has raised increasing attention in the electronics industry since the hazardous effects of SnPb solders.
Wei, Xin
core
Advanced Energy Materials, EarlyView.Organic photoelectrochemical cells based on π‐conjugated semiconductors offer a versatile platform for solar fuel generation. This review outlines operating principles, device architectures, and key metrics, and highlights advances in p‐ and n‐type photoelectrodes, interfacial engineering, and catalyst integration.
Jaehyeong Kim +8 more
wiley +1 more source
Creep behaviour of the ternary lead-free solder alloy : Sn-3.8wt.%Ag-0.7wt.%Cu [PDF]
, 2002 Electronic equipment is facing the challenge of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process ...
Cooper, Shellene
core +1 more source
Soft Artificial Ciliary Brush with Integrated Haptic Feedback for Efficient Airway Mucus Cleaning
Advanced Intelligent Systems, EarlyView.A fundamental mucus cleaning mechanism is reported, which utilizes both artificial cilia mechanical sweeping and suction‐based mucus cleaning. A novel haptic feedback interface for the artificial cilia provides touch feedback on tissue contact, enhancing operator control and safety.
Zhongming Lyu +7 more
wiley +1 more source
NANO-PARTICLE REINFORCED SOLDERS FOR MICROELECTRONIC INTERCONNECT APPLICATIONS [PDF]
, 2009 Ph.DDOCTOR OF ...
KATTA MOHAN KUMAR
core
steel research international, EarlyView.This work uses high‐temperature dilatometry to examine how the tramp elements Cu, Ni, and Sn affect the deformability of non‐metallic inclusions and matrix in quench‐and‐temper steel. Mg‐bearing inclusions deform less than Mg‐free ones. Copper lowers formability. Nickel increases deformability.
Julian Cejka +3 more
wiley +1 more source
Multiscale Modeling of the Anisotropic Creep Response of SnAgCu Single Crystal [PDF]
, 2015 The lack of statistical homogeneity in functional SnAgCu (SAC) solder joints due to their coarse grained microstructure, in conjunction with the severe anisotropy exhibited by single crystal Sn, renders each joint unique in terms of mechanical behavior ...
Mukherjee, Subhasis
core +1 more source
Packaging of Macroscopic Material Payloads: Needs, Challenges, Concepts, and Future Directions
Advanced Engineering Materials, Volume 28, Issue 9, 6 May 2026.This review introduces a unified framework that decomposes any macroscopic packaging system into the payload, packaging material, and packaging strategy and combines them into a conceptual packaging equation: packaging strategy = payload + packaging material.
Venkata S. R. Jampani, Manos Anyfantakis
wiley +1 more source
A Finite Element approach to understanding constitutive elasto-plastic, visco-plastic behaviour in lead free micro-electronic BGA structures [PDF]
, 2016 This work investigates the non-linear elasto-plastic and visco-plastic behaviour of lead free solder material and soldered joints. Specifically, Finite Element (FE) tools were used to better understand the deformations within Ball Grid Array solder ...
Graham, Caroline
core