The Effects of Aging on the Mechanical Behavior of Lead Free and Mixed Formulation Solder Alloys [PDF]
, 2010 The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In this work, the effects of isothermal aging
Zhang, Yifei
core
Harsh-Environment Packaging for Downhole Gas and Oil Exploration [PDF]
, 2007 This research into new packaging materials and methods for elevated temperatures and harsh environment electronics focused on gaining a basic understanding of current state-of-the-art in electronics packaging used in industry today, formulating the ...
Bansal, Shubhra +7 more
core +1 more source
National Educators' Workshop: Update 1991. Standard Experiments in Engineering Materials Science and Technology [PDF]
Given here is a collection of experiments presented and demonstrated at the National Educators' Workshop: Update 91, held at the Oak Ridge National Laboratory on November 12-14, 1991.
Gardner, James E. +2 more
core +1 more source
An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditions [PDF]
, 2017 With the rapid development in electronic packaging due to product miniaturisation, the size of solder joints is decreasing considerably, thus the failure of solder interconnects induced by electro-migration (EM) and thermo-migration (TM) became a ...
Guang Chen (25155)
core
Thermomechanical modelling of microstructure evolution in solder alloys [PDF]
, 2005 The reliability of soldered connections is a very important issue in electronics industry. This project aims to better understand the various factors influencing the lifetimeof solder joints through numerical modelling.
Ubachs, R.L.J.M.
core +2 more sources
JRA3 Electromagnetic Calorimeter Technical Design Report
, 2009 This report describes the design of the prototype for an Silicon Tungsten electromagnetic calorimeter with unprecedented high granularity to be operated in a detector at the International Linear Collider (ILC).
Anduze, M. +11 more
core +1 more source
Electrodeposition and characterisation of nickel-niobium-based diffusion barrier metallisations for high temperature electronics interconnections [PDF]
, 2016 The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies.
Jing Wang (6206297)
core
Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging. [PDF]
Sci Rep, 2023 Wang J +7 more
europepmc +1 more source
Effects of Aging on the Cyclic Stress Strain and Fatigue Behaviors of Lead-free Solders [PDF]
, 2014 The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments.
Mustafa, Muhannad
core
NASA Contributions to Metals Joining [PDF]
Survey of NASA supported metals joining research having industrial ...
Heuschkel, J., Reichenecker, W. J.
core +1 more source