The Materials Science behind Sustainable Metals and Alloys. [PDF]
Chem Rev, 2023 Raabe D.
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Comparison of the self-healing behaviour of 60Sn40Pb and 99.3Sn0.7Cu solder alloy reinforced Al6061 MMCs’. [PDF]
The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs'; the self-healing properties have been ...
Kumar, Gonal Basavaraja Veeresh +5 more
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A holistic approach to lead pipe scale analysis: Importance, methodology, and limitations. [PDF]
AWWA Water Sci, 2022 Harmon SM +5 more
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Beam lead technology for microcircuit interconnections with applications to metallization, passivation, and ...
Anderson, K. +7 more
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TEMPERATURE AND RATE DEPENDENT PARTITIONED CONSTITUTIVE RELATIONSHIPS FOR 95.5PB2SN2.5AG SOLDER ALLOY [PDF]
, 2004 One of the biggest challenges for power electronic devices is to be reliable in harsh environments. The operating temperatures in typical applications can go as high as 200ºC.
Gupta, Shirish Anurag
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Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers. [PDF]
Materials (Basel), 2020 Mirski Z, Ciepacz I, Wojdat AT.
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Program and the Book of Abstracts / Ninth Young Researchers Conference Materials Sciences and Engineering, December 20–22, 2010, Belgrade, Serbia [PDF]
, 2010 Young Researchers' meetings are held annually late in December since 2002 and they are organized by the Materials Research Society of Serbia. Originally conceived as seminars, since 2007 these meetings were transformed into conferences.
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Characterization of Thermo-Mechanical Damage in Tin and Sintered Nano-Silver Solders [PDF]
, 2018 : Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also ...
core
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder. [PDF]
Micromachines (Basel), 2018 Long X +5 more
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Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. [PDF]
Sci Rep, 2016 Li MY +4 more
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