Results 1 to 10 of about 135,051 (299)
IEEE Access, 2022 Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC.
Lamia Alam, Nasser Kehtarnavaz
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Sensors, 2023 In integrated circuit manufacturing, defects in epoxy drops for die attachments are required to be identified during production. Modern identification techniques based on vision-based deep neural networks require the availability of a very large number ...
Lamia Alam, Nasser Kehtarnavaz
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Advances in Electrical and Electronic Engineering, 2021 On-die testing can accelerate development of semiconductor devices, but poses certain challenges related to high frequency and high current switching. This paper describes design and development of a tester for double-pulse switching test and measurement
Jozef Kozarik +5 more
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Automatic Integrated Circuit Die Positioning in the Scanning Electron Microscope [PDF]
Scanning, 2002 AbstractIn scanning electron microscope (SEM)‐based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision‐based die positioning system that can automatically locate a specified failure site ...
Tan, H.W., Phang, J.C.H., Thong, J.T.L.
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Applied Sciences, 2021 This review paper reports the prerequisites of a monolithic integrated terahertz (THz) technology capable of meeting the network capacity requirements of beyond-5G wireless communications system (WCS). Keeping in mind that the terahertz signal generation
Chhandak Mukherjee +13 more
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Micromachines, 2021 A multi-function microelectromechanical system (MEMS) with a three-axis magnetometer (MAG) and three-axis accelerometer (ACC) function was implemented with an application-specific integrated circuit (ASIC)-compatible complementary metal-oxide ...
Chih-Hsuan Lin +2 more
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Technologies, 2020 The impact of process variations on circuit performance has become more critical with the technological scaling, and the increasing level of integration of integrated circuits. The degradation of the performance of the circuit means economic losses.
Zahira Perez-Rivera +2 more
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Integrated quantum optical phase sensor in thin film lithium niobate
Nature Communications, 2023 The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise and allows phase detection sensitivity ...
Hubert S. Stokowski +8 more
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Integrating Metal-Oxide-Decorated CNT Networks with a CMOS Readout in a Gas Sensor
Sensors, 2012 We have implemented a tin-oxide-decorated carbon nanotube (CNT) network gas sensor system on a single die. We have also demonstrated the deposition of metallic tin on the CNT network, its subsequent oxidation in air, and the improvement of the lifetime ...
Suhwan Kim +7 more
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Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision
Machines, 2015 Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies.
Hsuan-Ting Chang +2 more
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