Results 1 to 10 of about 181 (116)
A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing [PDF]
IEEE Access, 2022 Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC.
Lamia Alam, Nasser Kehtarnavaz
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Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN [PDF]
Sensors, 2023 In integrated circuit manufacturing, defects in epoxy drops for die attachments are required to be identified during production. Modern identification techniques based on vision-based deep neural networks require the availability of a very large number ...
Lamia Alam, Nasser Kehtarnavaz
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Automatic Integrated Circuit Die Positioning in the Scanning Electron Microscope [PDF]
Scanning, 2002 AbstractIn scanning electron microscope (SEM)‐based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision‐based die positioning system that can automatically locate a specified failure site ...
Hong Tan, J.C.H. Phang, John T. L. Thong
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BIST Method for Die-Level Process Parameter Variation Monitoring in Analog/Mixed-Signal Integrated Circuits [PDF]
2007 Design, Automation & Test in Europe Conference & Exhibition, 2007 Peer ...
Amir Zjajo +2 more
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Expert Systems with ApplicationsThe purpose of this research is to demonstrate the feasibility of automating ‘die-polygon-capturing’, an economical yet still labor-intensive technique for circuit extraction during the reverse-engineering of simple integrated circuits. As microchip designs become increasingly diverse with the ongoing trend of using application-specific integrated ...
Quint van der Linden +3 more
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Optics Express, 2018 In this paper we report a single mode InAs/GaAs quantum dot distributed feedback laser at 1.3 μm wavelength heterogeneously integrated on a Si photonics waveguide circuit. Single mode lasing around 1300 nm with a side-mode suppression ratio higher than 40 dB is demonstrated. High temperature operation with continuous wave lasing up to 100°C is obtained.
Sarah Uvin +9 more
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Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process [PDF]
Advances in Science and Technology Research Journal, 2020 A. Rahman, Nazrul Anuar Nayan
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Implementation of the universal asynchronous receiver-transmitter on the programmable logical integrated circuit die [PDF]
Politechnical student journal, 2018 И.В. Ронжин +1 more
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Advances in Electrical and Electronic Engineering, 2021 On-die testing can accelerate development of semiconductor devices, but poses certain challenges related to high frequency and high current switching. This paper describes design and development of a tester for double-pulse switching test and measurement
Jozef Kozarik +5 more
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Applied Sciences, 2021 This review paper reports the prerequisites of a monolithic integrated terahertz (THz) technology capable of meeting the network capacity requirements of beyond-5G wireless communications system (WCS). Keeping in mind that the terahertz signal generation
Chhandak Mukherjee +13 more
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