Results 11 to 20 of about 366,258 (347)

Integrated quantum optical phase sensor in thin film lithium niobate [PDF]

Nature Communications, 2023
The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise and allows phase detection sensitivity ...
Hubert S. Stokowski, Timothy P. McKenna, Taewon Park, Alexander Y. Hwang, Devin J. Dean, Oguz Tolga Celik, Vahid Ansari, Martin M. Fejer, Amir H. Safavi-Naeini   +8 more
doaj   +2 more sources

High-Resolution Short-Circuit Fault Localization in a Multilayer Integrated Circuit Using a Quantum Diamond Microscope [PDF]

Physical Review Applied, 2023
As integrated circuit (IC) geometry and packaging become more sophisticated with ongoing fabrication and design innovations, the electrical engineering community needs increasingly-powerful failure analysis (FA) methods to meet the growing ...
P. Kehayias, J. Walraven, A. Rodarte, A. M. Mounce   +3 more
semanticscholar   +1 more source

Review of Chemical-Mechanical Planarization Modeling for Integrated Circuit Fabrication: From Particle Scale to Die and Wafer Scales

, 2003
Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically.
Jianfeng Luo, David Dornfeld
openalex   +2 more sources

3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications

IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2022
Silicon carbide integrated circuits (SiC ICs) have been demonstrated to operate at high temperatures, such as ~460 °C at the Venus’ surface, for two months, and for over a year at 500 °C.
Feng Li
semanticscholar   +1 more source

Development of a Device for On-Die Double-Pulse Testing and Measurement of Dynamic On-Resistance of GaN HEMTs

Advances in Electrical and Electronic Engineering, 2021
On-die testing can accelerate development of semiconductor devices, but poses certain challenges related to high frequency and high current switching. This paper describes design and development of a tester for double-pulse switching test and measurement
Jozef Kozarik, Juraj Marek, Ales Chvala, Michal Minarik, Krisztian Gasparek, Martin Jagelka   +5 more
doaj   +1 more source

Towards Monolithic Indium Phosphide (InP)-Based Electronic Photonic Technologies for beyond 5G Communication Systems

Applied Sciences, 2021
This review paper reports the prerequisites of a monolithic integrated terahertz (THz) technology capable of meeting the network capacity requirements of beyond-5G wireless communications system (WCS). Keeping in mind that the terahertz signal generation
Chhandak Mukherjee, Marina Deng, Virginie Nodjiadjim, Muriel Riet, Colin Mismer, Djeber Guendouz, Christophe Caillaud, Hervé Bertin, Nicolas Vaissiere, Mathieu Luisier, Xin Wen, Magali De Matos, Patrick Mounaix, Cristell Maneux   +13 more
doaj   +1 more source

Multi-Function Microelectromechanical Systems Implementation with an ASIC Compatible CMOS 0.18 μm Process

Micromachines, 2021
A multi-function microelectromechanical system (MEMS) with a three-axis magnetometer (MAG) and three-axis accelerometer (ACC) function was implemented with an application-specific integrated circuit (ASIC)-compatible complementary metal-oxide ...
Chih-Hsuan Lin, Chao-Hung Song, Kuei-Ann Wen   +2 more
doaj   +1 more source

Gate Sizing Methodology with a Novel Accurate Metric to Improve Circuit Timing Performance under Process Variations

Technologies, 2020
The impact of process variations on circuit performance has become more critical with the technological scaling, and the increasing level of integration of integrated circuits. The degradation of the performance of the circuit means economic losses.
Zahira Perez-Rivera, Esteban Tlelo-Cuautle, Victor Champac   +2 more
doaj   +1 more source

Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

Electronic Components and Technology Conference, 2022
This work presents the implementation and characterization of a die-embedded, antenna-integrated glass package for RF modules in D-Band. The proposed package uses glass as the core material which can match the coefficient-of-thermal-expansion (CTE) well ...
Xiaofan Jia, Xingchen Li, K. Moon, Joon Woo Kim, Kai-Qi Huang, M. Jordan, Madhavan Swaminathan   +6 more
semanticscholar   +1 more source

Compact silicon photonics circuit to extract multiple parameters for process control monitoring [PDF]

, 2020
We present a compact interferometer circuit to extract multiple model parameters of on-chip waveguides and directional couplers from optical measurements.
Bogaerts, Wim, Geessels, Joris, Khan, Umar, Ruocco, Alfonso, Wang, Mi, Xing, Yufei   +5 more
core   +2 more sources